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Guest editor Chris Bonsell interviews Anthony Faraci from DIS Inc. about the optical lay-up of multilayers and optical alignment of rigid-flex boards. Over the last few years, DIS has redesigned their product line and introduced a robotic serialized pinless solution. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
The main task of the final finish is to protect the copper pad from tarnishing or oxidation while simultaneously keeping the surface active for the assembly. Electroless nickel/immersion gold (ENIG) is a widely accepted finish in the market that provides a good solderability and capability for Al-wire bonding. A main function of the gold layer is to prevent the oxidation of the nickel layer.
Have you ever played the game where you and your team try to build the tallest tower out of marshmallows and dry spaghetti (and sometimes tape) within a time limit? If you’ve played this fun game before, you know it’s...
“Customers do hate you.” That’s the way this book starts—with the hard truth. Customers enter a relationship with you, the seller, with a huge chip on their shoulders; they are often expecting the worst....
As the 118th U.S. Congress begins, we at IPC look forward to working with members of both parties to ensure the electronics manufacturing industry’s long-term success by advancing policies that increase innovation, investment,...
Last year turned out to be a fairly slow year for mergers and acquisitions (M&A) in the North American PCB and EMS sectors. We counted just seven completed or announced deals in the PCB sector last year, compared to 13 in 2021,...
Substrate Manufacturing: What Does It Take? with Jan Vardman
Heterogenous Integration Technologies Driving Advanced Packaging Solutions by Charles Woychik
MKS' Atotech: Chemically Connecting the Industry with Tobias Helbech
The Impact of Chip Packaging by Chuck Bauer
Everyone Wants Change: Who Wants to Lead the Way? with Mark Goodwin and Alun Morgan
An Advanced Packaging Year in Review by John Mitchell
