For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.

Features

• The Relentless Pursuit of Perfection, by Marcy LaRont
• Preventing Surface Prep Defects and Ensuring Reliability, by Marcy LaRont
• Key Insights on Photoresist for Defect Reduction with Josh Krick and Tim Blair
• Reducing Defects in Circuit Board Production, by Don Ball
• Traceability in PCB Production, by Kurt Palmer
• Efficiency Unleashed: Breaking Down Lean and Six Sigma, by Marcy LaRont
• Yield Improvement and Reliability, by Mike Carano

Columns

• Lobbying Congress Supports the Supply Chain, by Shane Whiteside
• PCBs Replace Motor Windings, by Happy Holden
• Understanding Global Citizenship as a Competitive Advantage, by Tom Yang

Articles

• Insights Into a Differentiating Trade/Investment Global Strategy with Rich Cappetto
• Hall of Fame Series: Highlighting Bob Neves, by Dan Feinberg

We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain. Our contributors discuss a broad range from strategy and growth, being nimble and resilient, and creating strength in the supply chain. Their answers provide an enlightening glimpse into where our industry finds itself right now and for the remainder of 2025.

Feature Interviews: Voices of the Industry

• TTM: Navigating Change, Mitigating Risk: We’ve Been Here Before with Tom Edman
• CEE PCB: Choosing the Right Strategic Path with Tom Yang
• NCAB: Ensuring a Strong and Reliable Supply Chain with Kelly Davidson
• ACE: Be Nimble, Quick, and Open to Change with James Hofer
• ALPHA CIRCUIT: Business Always Finds a Way with Prashant Patel
• VENTEC: Real Time with... IPC APEX EXPO 2025—Exploring Material Innovation with Mark Goodwin
• PLURITEC: Real Time with... IPC APEX EXPO 2025—Growth Depends on Developing Next-gen Products with Maurizio Bonati
• SCHMOLL AMERICA: Real Time with... IPC APEX EXPO 2025—Celebrating Their First Year with Kurt Palmer

Articles & Interviews

• IPC Hall Of Fame: Highlighting Jack Fisher by Dan Feinberg
• IPC APEX EXPO in the Rearview Mirror by Marcy LaRont
• The ROI of Workforce Training with Carlos Plaza and Tim Burke

Columns

• Can You Hear the Voices? by Marcy LaRont
• America, It's Time to Reclaim Manufacturing Leadership by Shane Whiteside
• Redefining Connection and Responsibility in Digital Transformation by Tom Yang
• Common Misconceptions in Wet Processing by Don Ball
• Causes of Plating Voids, Pre-electroless Copper by Mike Carano
• Registration in PCB Production Throughout the Process by Simon Khesin
• Novel Metallization for UHDI by Happy Holden

Corrosion, adhesion, bonding—the comprehensive issue of surface finish plating is a primary one for printed circuit board manufacturers and their assembly counterparts with gold as the “gold standard” for many applications. But gold is expensive, and it has its limits.

In the March issue of PCB007 Magazine, we compare and contrast surface finishes by type and application, taking a hard look at the many iterations of gold plating as a longtime standard and as palladium as a surface finish. We also take another look at a compelling additive manufacturing metallization product and technology. We go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore.

Features 

• The Golden Touch? by Marcy LaRont
• Gold as a Key Component in PCBs and IC Substrates by Britta Schafsteller, Sandra Nelle, and Kuldip Johal
• Next-generation Electroplating Systems by Happy Holden
• Electroninks' MOD and iSAP, Game Changers with Mike Vinson
• Observations on Palladium as a Final Finish by Happy Holden
• Surface Finishes for PCBs by Don Ball
• Organic Addition Agents in Electrolytic Copper Plating by Mike Carano
• Excerpt: Novel Surface Finish for 5G-mmWave Frequency PCB Technologies by Kunal Shah

Articles

• The Rise and Demise of AlliedSignal Laminate Systems by Manfred Huschka
• Highlighting Walt Custer by Dan Feinberg
• Pioneering the Future of Substrate Manufacturing for North America with Ralph Jacobo

Columns

• Schmoll: Decades of Technology Evolution by Kurt Palmer
• Reshoring: About Trust, Not Just Geography by Shane Whiteside

2025 marks the 25th anniversary of IPC APEX EXPO, our industry's largest global trade show completely dedicated to the printed circuit board supply chain. Being held in Anaheim again this year, IPC APEX EXPO takes place from March 15–20. This year's theme is "Reimagining the Possibilities," which feels apt as they mark this 25-year milestone.

Features

• It’s Show Time! by Marcy LaRont
• Imagine the Possibilities: Tech Conference 2025 with Stan Rak and Udo Welzel
• IPC APEX EXPO 2025 Marks a Special Anniversary Year for the Show by Dr. John W. Mitchell
• Breaking Down the IPC APEX EXPO Experience by Marcy LaRont
• Earthquakes, Astronauts, and Aquatics: A Lighter Look at the Past by Don Ball
• Empowering Women in Electronics: An Evening of Connection and Inspiration by Alicia Balonek
• Maximizing the Five Stages of Your Trade Show Exhibit by Dan Beaulieu
• Hannah Nelson: The Inspiring Journey of an Emerging Engineer
• Paige Fiet: From Emerging Engineer to Quality at TTM
• The Secret Value of Committee Work by Teresa Rowe
• Standards Out in Front at IPC APEX EXPO by Teresa Rowe
• An Overview of the Keynote Presentations by Marcy LaRont
• Sustainability Highlights: IPC’s Commitment to a Greener Future by Kelly Scanlon
• Standards Driving Factory of the Future with Thomas Marktscheffel

Extras

• Long-time Challenges Confront a New Administration by Shane Whiteside
• Hall of Fame: Highlighting Denny Fritz by Dan Feinberg
• 25 Years of Technology
• 25 Years of IPC Keynotes

Workforce is a topic of conversation in manufacturing businesses that occurs nearly as often today as discussing quality and reliability. In this issue, we look at fueling the workforce pipeline, specifically at the early introduction of manufacturing to young people. It’s a unique, somewhat unconventional, and long-term perspective aimed at filling the skilled labor gap.

Features

• Bridging Career Pathways in Electronics with Lisa Burns
• Mapping the Future of the Electronics Workforce by Dr. John W. Mitchell
• Bridging the Gap: Workforce Collaboration in Deep East Texas by Cory Blaylock
• How I Became an Engineer with Happy Holden
• Better Fabs Attract a Better Workforce by Don Ball
• Empowering Interns: Shaping Tomorrow's Tech with Gerry Partida
• U.S. Work Visas Demystified by Marcy LaRont
• New Youth Book Addresses Manufacturing Awareness Gap with Michael Nager
• Building a Manufacturing Career at DIS with Ryan Moore and Emily Telesca

Articles

• The Future of Electronics Manufacturing in APAC by Daniel Schmidt
• IPC Hall of Fame Spotlight Series: Highlighting Doug Pauls by Dan Feinberg

Columns

• New UHDI Materials by Happy Holden
• New Congress, New Opportunities by Shane Whiteside

In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line, increasing the accuracy in your inner layer production is essential for all PCB fabricators. Not doing so will ensure that, eventually, you’re no longer in the game.

Features

• Boosting Your Inner Layer Precision and Production Outcomes by Marcy LaRont
• Revolutionizing Inner Layer Registration with Tony Faraci
• The Effects of Copper on a Transmission Line by Todd Kolmodin
• Can Changing Spray Nozzles Improve My Etch Quality? by Don Ball
• Revolutionizing PCB Testing with RoBAT with Bruce Nockton
• Statistically Testing Inner Layer Yield Improvements by Dr. Pat Valentine

Interviews

• NAMICS Brings Innovative Thermoset Materials to PCB Fabrication with Ken Araujo and Matt Lake
• Expansion, Retirement, and New Leadership at FCT with Carey Burkett and Ray Cottrell

Columns

• Success in Washington Requires Patience, Persistence, and Sustained Focus by Shane Whiteside
• The LEGO Principle of Optical Assembly by Happy Holden
• ‘Twas the Night Before Christmas: Harley-style by Steve Williams

Articles

• Does China Plus One Really Make a Difference? Part 2 by Manfred Huschka
• IPC Hall of Fame Series: Highlighting Gene Weiner by Dan Feinberg

Sometimes called "Engineering Economics," there are many things one should be aware of to truly understand real costs. But of course, yield is everything in this business and building more accuracy into our boards as well as finding defects before too much cost is built into the boards is critical to a PCB fabricator’s success. In this issue, we examine the real cost of manufacture through several different lenses.

Features

• Engineering Economics by Marcy LaRont
• Designing for Cost to Manufacture with Richard Koensgen
• Process Yield Statistics and Distributions by Dr. Pat Valentine
• Make the Investment Where It Really Counts by Dan Beaulieu
• Calculating PCB Complexity and First-pass Yields by Happy Holden
• Case Study: PCB Design Flaws in a Satellite Project by Matt Stevenson
• Break-even Time (BET) by Happy Holden
• Understanding Depreciation for Electronics Manufacturers by Doug Palladino
• Yields March to Design Rules by Happy Holden

Columns

• The Benefits of Continuing Education by Paige Fiet
• Getting the Best From Your Cupric Chloride Etchant by Don Ball
• Does China Plus One Actually Work? by Manfred Huschka
• New Administration, But Our Industry’s Needs Remain by Shane Whiteside

Extras

• Highlighting Patty Goldman by Dan Feinberg
• Has the Need for Tin-Nickel Plating Finally Come? with Mike Carano and Happy Holden

Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods.

Features

• Destination Metallization by Marcy LaRont
• The Cost-Benefit Analysis of Direct Metallization with Carmichael Gugliotti
• Video Interview: A Critical Comparison of Metallization Methods with Carmichael Gugliotti
• Exploring Advanced PCB Final Finishes: DIG and RAIG by Richard DePoto
• Processes to Support IC Substrates and Advanced Packaging, Part 5 by Mike Carano
• Unlocking Advanced Circuitry Through Liquid Metal Ink with John Johnson
• Exploring Innovation Through Alternative Metals and Sputtering with Dr. Evelyne Parmentier

Interviews and Articles

• DIS Leaping Into Tech and Automation with Jesse Ziomek
• TTM’s Grand Opening in Malaysia with Tom Edman
• Root-cause Analysis and Problem-solving by Happy Holden
• The IPC Hall of Fame and Its Namesake by Dan Feinberg

Columns

• A Conversation with David Griesel, CEO of Sunrise Group by Preeya Kuray
• Troubleshooting PCB Process Problems by Don Ball
• Navigating Maternity Leave in the Electronics Industry by Hannah Grace
• There’s No Substitute for American-made Microelectronics by Shane Whiteside
• Producibility and Other Pseudo-metrics by Happy Holden

In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to these all-important questions: What is my company’s technology roadmap? Is there anything so epic that it will change my business and/or my industry significantly in the near and distant future? What is driving the changes I will make in my facility? And most importantly, how will I implement this vision and reach the intended destination for my organization?

Features

• Charting the Future by Marcy LaRont
• Mastering Technology Prognostication by John Mitchell
• Stringent High-speed Requirements Pose Technology Challenges by Tarja Rapala, Joe Beers
• How We Deal With a Technology Roadmap by Don Ball
• Global Perspectives: The Future of PCB Technology with Joe Dickson
• Tech Trajectories: Projecting Trend Advancements by Srikanth Chandrasekaran

Articles

• Data-driven Industrial Digital Solutions Drive Quality and Reduce Costs by Mikalai Kuchuk
• Inside the New Facility at DIS with Tony Faraci, Jesse Ziomek

Columns 

• Interconnect Defect: The Three Degrees of Separation by Mike Carano
• Let’s Finish the Fight to Buy and Build American by Shane Whiteside, PCBAA
• Wet Process Management and Control by Happy Holden

In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products. We spend time discussing ROI because nothing is undertaken on the shop floor where ROI is not evident and hopefully soon realized.

Features

• Attaining Superior Wet Process Control by Marcy LaRont
• Maximizing ROI Through Better Wet Process Control with Mike Carano
• Chemical and Equipment Control for High-density Circuits, Part 2 by Don Ball
• Automated Chemical Dosing for Enhanced Control and Safety with Mike Brask
• Things You Can Do for Better Wet Process Control by Mike Carano
• Three Simple Ways to Manage and Control Wet Processes by Happy Holden
• Audits: A Critical Element of Process Control by Randy Cherry
• Automation Innovations and Better Process Control with Mark Skaer

Articles

• Advancements in Drill Bit Technology with Alex Girardot
• A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing, white paper excerpt from Dr. Maarten Cauwe, et al.
• Young Professionals Spotlight: Process Engineer Kevin Dial

Columns

• The Impact of Parasitics on PCB Design by Hannah Grace
• The U.S. Economy Needs Trusted PCBs by Shane Whiteside

If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. What does it take to remain viable and grow and prosper during so much change? In this issue, our contributors explore these concepts meant to help you take your business to the next level.

Features

• The Art, Science, and Reality of Thriving by Marcy LaRont
• To Thrive, Surround Yourself With Good People by John Mitchell
• Are You Ready to Thrive? Keep an Open Mind with Anaya Vardya
• Thriving in the Global PCB Market with Kurt Palmer
• I’ve Found My ‘Why’ by Paige Fiet
• Thriving With New Processes and Technologies with Jesse Ziomek
• From Concept to Reality: Building Alpha Circuit by Prashant Patel
• Thriving Through Partnership: Alpha Circuit’s Journey with IPS with Mike Brask

Articles

• Technology Adoption and the Role of Automation by Happy Holden
• A Less Expensive PCB Fab Startup by Alex Stepinski
• A Visit to RoBAT by Pete Starkey

Columns

• Support IC Substrates and Advanced Packaging, Part 5 by Mike Carano
• Domestic Manufacturing Takes Center Stage on Capitol Hill by Shane Whiteside
• Controlling an Alkaline Etch Bath With Low Copper Loading by Don Ball
• Novel Ultra HDI Architectures by Happy Holden

Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. Beyond supply management, panel utilization and handling are critically important yield considerations. When building high mix, low volume, and high technology,  managing materials and overall cost containment are even greater challenges.

Features

• All Things Material by Marcy LaRont
• The Critical Role of Materials with Anaya Vardya
• Beyond Prepreg: The Glassless ‘Revolution’ with Alun Morgan
• Materials for PWB Fabrication: Drillability and Metallization by Mike Carano
• Non-RF High-Speed Materials Continue to Advance with Ed Kelley
• Building Resilient Supply Chains by Mark Goodwin
• Mustaches and Automation in Flexible PCB Fabrication by Chris Clark

Articles

• Expansion and Growth: You Can’t Do It Alone by Prashant Patel
• Pushing the Limits of PCB Impedance Control by Alex Knowles

Interviews

• Overcoming Workforce Challenges from Onboarding to Upskilling with David Hernandez
• Tom Edman Leads IPC Board of Directors
• Shane Whiteside Appointed as New PCBAA Chair

Columns 

• Chemical and Equipment Control of High-density Circuits by Don Ball
• Changing Leadership and Three Years of Advocacy in D.C. by Travis Kelly
• The Analog Computer by Happy Holden

Though modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.

Features

• The ‘Magic’ of Additive Processes by Marcy LaRont
• Will Modern Additive Manufacturing Revolutionize PCB Manufacturing? with Alex Stepinski
• Can the Limits of Subtractive Etching Be Extended? by Don Ball
• Moving Additive Technology Forward with Milena and Hans Fritz
• Saying ‘Yes’ to Additive Technology at Winonics with Dennis Brown, Gary Abel, and Sidali Koulougli
• Revolutionizing PCB Prototyping With ML and AM by Nick Geddes
• Advancing PCB Technology: A Conversation With John Johnson by Barry Matties
• Manufacturing Differently With Digital Technology with Antonio Schmidt and David Hahn
• Plastronics and IPC Guidelines for In-Mold Electronics with Francis Fourcade

Interviews

• Young Professionals: Meet Evan Griffith, Indium
• Update with IPC India’s Gaurab Majumdar
• The Global Industrie Show and IPC Europe with Philippe Leonard
• IPC APEX EXPO Retrospective: The Founders Look Back with Dan Feinberg and Gene Weiner

Columns

• Lessons from the Best Engineer I Ever Met by Paige Fiet
• Bend to Install Semi-flex FR-4, by Happy Holden
• Batting .333: Great in Baseball, Not in Microelectronics by Travis Kelly

After more than two decades of steady decline in the U.S., the PCB industry is finally growing in the West thanks to the CHIPS and Science Act, DoD funding, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act. The U.S. is now in a race to regain what was lost and then some.

But what does “growing” look like for the organizations that have received DoD funding, and for the rest of us? How can we sustain this growth?

In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it. 

Features

• The New Industry: Will the Growth Continue? with Shawn DuBravac and Tom Kastner
• Right Sizing ZLD and a Model for PCB Startups with Alex Stepinski
• TTM’s High Tech Expansion and Industry Innovation with Tom Edman
• USPAE to Springboard U.S. Technology Forward with Joe O’Neil
• Shane Whiteside Discussing PCB Landscape

Interviews and Articles

• The Ever-expanding Horizons of PCB Manufacturing: Global Trends and Local Impacts by Lea Maurel
• Advocacy: There is No Time to Waste with Rich Cappetto and Kate Koger
• Solving Problems and Validating Excellence with Randy Cherry
• Young Professionals: Meet Jennifer Robinson

Columns

• The Growing Industry by Marcy LaRont
• Reliability in the Delivery Room by Henry Crandall
• What About the Rest of the Technology Stack? by Travis Kelly
• Reducing Etch System Water Usage, Part 2 by Don Ball
• The Dielectric Constant of PCB Materials by Preeya Kuray
• The Power Mesh Architecture for PCBs by Happy Holden

Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing. Oxford defines it as “the ability to be maintained at a certain rate or level.” Today, when we say “sustainability” in business, we are speaking of environmental sustainability—the ability to operate our businesses in a way that does not hurt or deplete our natural resources and our global environment. For most business owners, though, sustainability is, first and foremost, a business's ability to continue doing business. But as Dr. Kelly Scanlon of IPC has pointed out, the concept of sustainability applies to many areas, including the economy, training, and education.

In this month’s issue of PCB007 Magazine we focus on the hot button issue of sustainability and examine it through the lens of several individuals and organizations.

Features

• The Many Flavors of Sustainability by Marcy LaRont
• The Delicate Balance of Sustainable Business and Going Green with Alex Stepinski
• Attracting ‘Generation Green’ by Paige Fiet
• Digitalisation and ESG by Marina Hornasek-Metzl
• Sustainability Challenges: A Collaborative Approach by John Mitchell
• Reducing Etch Water System Usage, Part 1 by Don Ball
• Water Management in a Large Printed Circuit Board Manufacturer by Charles Nehrig
• An Ultimate Goal in Sustainability: Recyclable PCBs with Jan Pedersen
• The Many Complexities of PFAS with Dr. Kelly Scanlon
• Designing for Cost and Sustainability with Erik Pedersen
• IPC Standards and Sustainability: More than Meets the Eye by Dr. Kelly Scanlon

Articles

• IPS Technology Showcase with T. Houchin, L. Boehm and K. Glazier
• Inkjet Solder Mask Has ‘Arrived’ by Pete Starkey
• Saying Goodbye to Industry Icon Tony Hilvers

Columns

• Going Beyond the CHIPS Act to Power American Manufacturing by Travis Kelly
• I Hear the Train a Comin’ by Steve Williams
• Integrated Mesh Power Systems (IMPS) for PCBs by Happy Holden
• The Importance of Standards for the Chip Packaging Industry by Preeya Kuray

Like any great tech industry event, IPC APEX EXPO pushes us out of our busy 24/7 manufacturing bubbles. It forces us to pay attention to things that are important but not always present in our day-to-day lives. This issue previews many of the important events taking place at the show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.

Features

• Countdown: The Fabricator’s Guide to IPC APEX EXPO by Marcy LaRont
• IPC APEX EXPO: What Fabricators Should Know with Matt Kelly, Julia Gumminger, Udo Welzel and Stanton Rak
• What’s Next Becomes Now by John Mitchell
• A Brief History of IPC APEX EXPO by Alicia Balonek
• Dip Your Hand in the IPC APEX EXPO Candy Jar by Hannah (Nelson) Grace
• Women in Electronics Reception by Alicia Balonek
• Electronics Circuit World Convention: A Brief History by David Bergman
• An Exhibitor’s View of IPC APEX EXPO by Don Ball
• Professional Development: From AI to DFM by Julia Gumminger
• ECWC16 Technical Conference Special Sessions by Julia Gumminger
• Standards Development Propels the Industry Forward by Teresa Rowe

Columns

• Congress Must Handle Supply Chain Challenges in 2024 by Travis Kelly
• Supporting IC Substrates and Advanced Packaging, Part 5 by Mike Carano
• Why 4-wire Kelvin? by Todd Kolmodin
• Balancing the Density Equation by Happy Holden

Interviews

• Real Progress Toward Solving U.S. Workforce Problems with Cory Blaylock
• IPS Engineers on AI and More by Barry Matties

In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship? After all, as a fabricator, you’re manufacturing what is often the only custom part on the entire electronics sub-assembly. Earlier this month, we published an issue of Design007 Magazine helping designers better understand how to work with you, the fabricator. So, what’s key to improving your understanding of how your customer ticks? In this issue, we investigate how to build a good communication relationship with your customers. Dana Korf, an I-Connect007 columnist, contributed a feature article this month titled, “The Designer and Manufacturer Must Be in Sync.” NCAB’s field application engineers explore how to foster loyal customer/vendor relationships.

Features

• Let Your Walls Down by Nolan Johnson
• The Designer and Manufacturer Must Be in Sync by Dana Korf
• Getting to Know Your Vendor by Don Ball
• Fostering Loyal Relationships with PCB Design Engineers by Ryan Miller and Jeffrey Beauchamp
• Driving Operational Efficiencies at Summit Interconnect with Sean Patterson
• The Flexibility We Need in Standards-driven Manufacturing with Mark Goodwin

Columns

• Culture Change is Key to a QMS by Steve Williams
• Easing the Learning Curve for Young Professionals by Paige Fiet
• Lab-on-PCBs for Medical Diagnosis by Happy Holden
• What Electricity Tells Us About Our Health by Henry Crandall
• Electrodeposition of Copper, Part 6 by Mike Carano

Technical Article

• New Resin Systems Used to Solve Circuit Board Fabrication Issues by Steve Schow, Bob Gosliak and Thomas McCarthy

Operating a PCB fabrication company is a lot like piloting a sailboat—you need to keep your eye on the prevailing conditions, or you might find yourself lost, or in danger of sinking. That’s where PCB007 Magazine comes in.

In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.

Features

• Winds of Change, by Andy Shaughnessy
• A Chief Economist’s Industry Forecast for 2024, with Shawn DuBravac
• Joe O’Neil Has More Optimism Than Concerns
• ‘Blocking and Tackling’ During Tough Economic Times, by John Mitchell
• Economic Outlook for 2024 and Beyond, by Anaya Vardya
• Fabricators Investing in High-Tech Equipment, Processes, and Labor, with Aidan Salvi
• Mil/Aero Leading the Way in 2024, with James Hofer
• The Economics of Equipment Selection, by Barry Matties
• Five Tips to Keep Your Business Strong in an Economic Downturn, by Steve Williams
• IPC Europe: Raising the Industry Flag of Support, with Philippe Leonardo and Francisco Fourcade
• A Progress Report: Investing in US PCB Fabricators, with David Schild

Columns

• Electrolytic Copper Plating, Part 5, by Michael Carano
• My Review of Happy Holden’s ‘24 Essential Skills for Engineers,’ by Hannah Nelson
• The High Cost of Etcher Non-maintenance, by Don Ball

Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring, because a slight error up front will only snowball as the process continues.

Features

• The Registration Sweet Spot by Nolan Johnson
• Recent Practices in PCB Fab Registration System Architecture by Alex Stepinski
• Registration: From Raw Data to Intelligent Manufacturing by Andrew Kelley
• Performance and Registration: Coupons to the Rescue! by Happy Holden
• Amitron's Leap into the AI Frontier interview with Aidan Salvi

Articles

• Amitron Progressing Toward a Factory 5.0 Future audio interview by Nolan Johnson
• Meet IPS Workforce: Inoa Wahinehookae video interview by Barry Matties

Columns

• A Conversation with Congressman Blake Moore by Preeya Kuray
• Teach the Terminology by Paige Fiet
• PCBAA Member Profile: Hari Pillai by Travis Kelly
• The Next Wave of Wearable Health Monitor Innovation by Henry Crandall
• Dartmouth—Taking a Human-centered Approach by Mike Konrad

High-reliability fabrication presents a number of challenges and tradeoffs for fabricators, along with a myriad of market opportunities. What do we mean by high reliability? How much investment does it take for a traditional board shop to move into the ‘high-rel’ realm? How do you measure reliability failure? And after four years of research, why can’t the North American fab industry figure out the root cause of microvia failures?

In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication. We also detail the tradeoffs involved in maximizing reliability while reducing your costs and introduce you to experts and resources that can help you raise your reliability levels.

Features

• Exploring High-Reliability Fabrication, by Andy Shaughnessy
• High-Reliability Fab Overview, with Alex Stepinski
• The Material Science of PCB Thermal Reliability, by Preeya Kuray
• Financial Risks of Ignoring Copper Grain, by Alex Stepinski
• Planning, DFM, and Inspection: Keys to High-reliability Fab, with Marc L’Hoste
• Reliability of Printed Circuit Boards, by Reza Ghaffarian

Columns

• Large Panel Processing, by Happy Holden
• Reimagining PCB Design in Education, by Hannah Nelson
• What We Learned at PCB West, by Travis Kelly

Articles

• Meet the New Workforce at IPS, by Barry Matties
• AI Revolution Reshaping the Future of PCB Manufacturing, by Val Kaplan

New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. And then there’s the impact of the CHIPS Act.  

In this issue, we look at materials, advanced packaging and UHDI fundamentals from multiple directions with industry voices ranging from fabricators to equipment manufacturers, to industry advocates.  

We also bring you special coverage with conversations from some of the suppliers to the ultra-modern fab and assembly facility in Moscow, Idaho, built by Schweitzer Engineering Laboratories. 

Features 

• Convergence by Nolan Johnson 
• The Drive Toward UHDI and Substrates interview with Darren Hitchcock 
• What is UHDI? by Happy Holden 
• Cutting-edge Inspection Challenges by Brent Fischthal 
• Pivoting on Substrates interview with Oved Shapira 
• Building a Domestic ‘Silicon to Systems’ Ecosystem by Matt Kelly

Special Coverage

• The SEL Supply Line by Barry Matties 
• GreenSource Engineering: An Eye on Design 
• Notion Systems: The Arrival of the ‘Jet Age’ 
• Sigma Mecer: Turning Copper ‘Green’
• Schmoll: Pushing Drilling Forward
• Atotech: More Horizontal Panel Plating in the U.S.
• Chemcut: Blending Capabilities and Culture

Columns 

• The Pros and Cons of Tribal Knowledge by Paige Fiet 
• Why TDR? by Todd Kolmodin 
• Don’t Just Blame the Etcher by Don Ball 
• Processes to Support IC Substrates and Advanced Packaging, Part 4 by Mike Carano 
• Computer-Aided Bare Board Testing, Revisited by Happy Holden

Article

• Culture by Design: Building a Winning Team from the Start by Brian Wallace

Today’s PCB fabricators face a variety of market and supply chain obstacles in addition to competitors down the street and overseas. A solid strategy is a critical part of success. This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies.

Feature Interviews

• Discussing SEL’s Strategy, with David Whitehead
• A Look Inside SEL’s New PCB Factory, with John Hendrickson and Mike Brask
• Going Green, with John Hendrickson
• Innovations in Final Finishing, with Mike Brask
• TTM CEO Tom Edman on the Process of Strategy, with Tom Edman
• Jet Appeal, with Carsten Sundin, Aaron Park, Austin Alley, and John Smoker
• What’s Your Process for Developing a Strategy? with Tim Rodgers
• Developing a Fabrication Business Strategy, with Christopher Chapman

Feature Articles and Columns

• Developing a Strategy, by Andy Shaughnessy
• Developing Your Team to Become Great Implementors, by John W. Mitchell
• 10 Steps to Outstanding, by Dan Beaulieu

Columns

• Smoothing the Rocky Road of Onboarding, by Hannah Nelson
• India’s Rise in the Global Electronics Ecosystem, by Preeya Kuray
• Member Profile: Melanie Bera Anderson, by PCBAA

If returning to continuous improvement practices to increase the operational efficiencies inside your company wasn’t enough motivation, staying competitive in a thriving and changing industry certainly ought to tip the scales toward continuous improvement. In other words, continuous improvement never goes out of style. And it starts with leadership.

In this issue, we explore how TQM specifically has entered the DNA of continuous improvement disciplines, and the role leadership plays in transformation. If you've ever competed against a TQM company, you understand their winning advantage. So, how do you start on the journey to modern TQM implementation?

Features 

• TQM is So Much MORE Than Quality interview with Happy Holden
• Data, Analysis & TQM interview with Chris Chapman
• Lean vs. TQM vs. Six Sigma by Steve Williams
• Hiring With Leadership Style in Mind by Brian Wallace
• Recollections on Deming by Mark Wolfe
• How to Tell If You’re Working with a TQM Company by Tim Rodgers
• Hiring for Soft Skills in Technology by Brian Wallace

 Feature Columns

• vTQM – Continuous Improvementby Nolan Johnson
• Developing an Improvement Process by Paige Fiet
• Playing the ISO Game for Better Quality by Jamin Wilson

Columns 

• Taking the Fight to Capitol Hill by Travis Kelly
• Processes to Support IC Substrates and Advanced Packaging, Part 3 by Mike Carano
• Beyond the Horizon: Exploring the Digital Future of Health by Henry Crandall
• Embedded (Flush) Circuits by Happy Holden

You must have an effective hiring strategy if you want to attract—and retain—skilled workers. Does your company have such a strategy? If not, we have the information you need to get your hiring plans up and running. In this issue of PCB007 Magazine our expert contributors discuss current trends in hiring, including what the next generation wants in a career. We also cover a variety of ways to ensure that you are hiring the best person for the job, as well as how to “sell” your company to recruits.

Features

• Engagement Begins Before Employment, by Brian Wallace
• Fire Your Hiring Habits, by John W. Mitchell
• It’s a Brave, New Workforce, by Hannah Nelson
• What Are Hiring Managers Looking For? with Paul Farquhar
• ‘I’ve Never Been Interviewed Before’, with Joseph LaRosa
• Talent Tectonics, a book review by Dan Beaulieu

Columns

• Help Wanted, by Andy Shaughessy
• Solutions for Better Etch Uniformity, by Chris Bonsell
• Teaching Coding to Kids: The UK’s Micro:bit Tool, by Happy Holden
• The Revival of Domestic PCB Fabrication, Preeya Kuray
• PCBAA Member Profile: Frank Medina, by Travis Kelley
• Reduction Assisted Immersion Gold for ENEPIG Surface Finish, by George Milad

Interview

• Burkle North America: Service With a Smile, with Evan Howard

It’s easy to think we’ve got customer service mastered, but do we really? Customer service is equal parts science, art, and inspiration. We can engineer it, define it in policy, but in the end, it’s our attitude, our empathy, that makes all the difference. In this issue, we bring you a wide range of stories that show customer service for what it is: an achievable goal.

Features

• Eye on the Ion interview with Joey Sanchez
• Dan Beaulieu’s Five Favorite Customer Service Columns an I-Connect007 Compilation
• A Mini Manufacturing Ecosystem by Paige Fiet
• Customer Service Starts With a Quality Product interview with John Johnson
• The Mindset Behind the Customer Experience interview with Brian Wallace
• The Most Important Thing About Customer Service interview with Marge Laney
• Positivity Boosts Employee Morale by Todd Kolmodin
• Knowledge: The Heart of Great Customer Service interview with David Thomas

 Articles

• A Focus on Ultra HDI interview with John Johnson
• The Birth of the Circuit Board interview with Rex Rosario
• Chemical Legislation and Restrictions on Solder Masks by Chris Wall
• Proving Mentorship Works interview with Christina Trussell and Garry McGuire

 Columns

• A Tale of Quality Customer Service by Nolan Johnson
• What’s an Annular Ring? by Matt Stevenson
• My Journey from Atomic Lattices to Circuit Boards by Preeya Kuray
• Electrodeposition of Copper, Part 4: Addition Agents by Michael Carano
• Next-generation Electroplating Systems by Happy Holden
• Taking the Fight to Capitol Hill by Travis Kelly
• The Challenges of Thin Material Transport by Christopher Bonsell
• Leadership 101: Be a Heretic, not a Sheep by Steve Williams
• How Health Smart Are Smartwatches? By Henry Crandall

When you started working at your first job, were you told to sink or swim? That approach used to be the rule, not the exception, because hiring managers always had a stack of resumés on hand. But with today’s labor shortage, hiring managers are considering revamping their onboarding processes to avoid staff turnover. In this issue, our contributors provide a set of best practices for successful, swift onboarding of new hires, and methodologies for turning new employees into happy, long-term staff.

Feature Articles

• A Strong Start by Andy Shaughnessy
• Effective Strategies for New Hires, by Hannah Nelson
• Rethink Your Onboarding Strategy, by John W. Mitchell
• Solving Your Talent Problem, by Dan Beaulieu
• Preparing Employees for the Long Haul, by Todd Kolmodin
• Engaging the Next Generation, by Christopher Bonsell
• Hiring the Crazy and Obnoxious, by Dan Beaulieu
• PCBAA’s New Representation, by David Schild

Feature Interviews

• Onboarding Takes Training, Technique, and Trust with Frank Lorentz
• The Importance of Matching Business and Personal Goals with Joey Sanchez
• The Secret to Successful Onboarding with John Izzo
• Schweitzer: Essential Onboarding, and Quickly with Frank Harrill and Jessi Hall
• Onboarding 101, with Mike Hoyt
• The Issues With Talent, with Anaya Vardya
• A Texas Trade School Links Young Students and Employers with Elvia Quintanilla
• Interviewing? Delve into Company Culture with Brian Wallace

Columns

• Lead-free and the Fabrication Challenge, Part 1, by Michael Carano
• Putt’s Law and the Successful Technocrat, by Happy Holden

We’re three months into 2023 and wrapping up our first quarter. So, as a PCB fabricator, what’s on your mind? Is it time to assess, and perhaps reassess, your expectations for the year and whether your reality is meeting your predictions? What are you hopeful about? What’s making you nervous? What are the opportunities and the obstacles to your business right now?

Feature Interviews

• View From the Summit with John Vaughan
• Preparing for a New Normal in Logistics with Mark Goodwin and Alun Morgan
• A Goal of Higher Technology with Matt Stevenson
• Invested in Growth with Anaya Vardya
• Bigelow: Bullish on Fab’s Future with Peter Bigelow
• Organizing Materials Differently with Didier Mauve and Mark Goodwin

Feature Columns

• The Fabricator’s Mindset by Nolan Johnson
• Where Can We Improve? by Todd Kolmodin

 Columns

• Finishing the Job the CHIPS Act Started by Travis Kelly
• Processes to Support IC Substrates and Advanced Packaging, Part 2 by Mike Carano
• My Top 5 Skills for Manufacturing Engineers by Paige Fiet
• What You Need to Know About Getting a PhD by Henry Crandall
• Chemical Control for Wet Processes by Chris Bonsell
• Leadership 101: The Law of Legacy by Steve Williams

It’s time to amp up your business with your newfound knowledge. In this issue of PCB007 Magazine, our expert contributors provide methodologies for you to create your own post-show plan of action and identify the important points to consider within that plan. We also provide ways to implement these process steps. Readers will learn various paths for implementing their post-show plan across multiple teams within their company.

Features

• After the Show, Now What? by Andy Shaughnessy
• Post-show Plans Depend on Solid Pre-show Strategies, by Dan Beaulieu
• Making the Most of Trade Show Leads, by Barry Matties
• An After-show Plan, Interview with Kris Moyer
• A Post-show Marketing Plan, by Kiki Shemomae
• Wet Process Start-up Considerations, by Christopher Bonsell
• Step Up and Volunteer, by Hannah Nelson

Columns

• Can You Build EVs Like PCs? by Happy Holden
• Supporting IC Substrates and Advanced Packages, Part 1, by Michael Carano
• A Collective Stake in American Microelectronics by Travis Kelly

Articles

• The Automated Future of PCB Fabrication Interview by Dan Beaulieu
• Schweitzer: The Captive Partnership, Interview with John Hendrickson, Frank Harrill, and Jessi Hall

As semiconductor companies seek ways to prolong Moore's Law, new advanced component packaging techniques, and in-package substrates, are blurring the boundaries between printed circuit fabrication and semiconductor fabrication. Are there strategic opportunities–new directions in which to shift your business–in this new space? In this issue, we open the discussion about how advanced packaging will change the structure of our industry.

Featured Articles and Interviews
Substrate Manufacturing: What Does It Take? with Jan Vardman
Heterogenous Integration Technologies Driving Advanced Packaging Solutions by Charles Woychik
Advanced Packaging Beyond the Zetabyte Era by Tom Rucker
MKS' Atotech: Chemically Connecting the Industry with Tobias Helbech
The Impact of Chip Packaging by Chuck Bauer
Everyone Wants Change: Who Wants to Lead the Way? with Mark Goodwin and Alun Morgan

Feature Columns
An Evolution by Nolan Johnson
An Advanced Packaging Year in Review by John Mitchell
Advanced Packaging Not Just a Passing Fad by John Watson

Columns
Protocols for a Smart Factory Future by Happy Holden
A Tale of Two Towers by Paige Fiet
Turning Into the Wind by Todd Kolmodin
The Subtractive Vision by Chris Bonsell

It's almost 2023, and we’re looking forward to meeting up with many of you at IPC APEX EXPO 2023. There’s a lot of excitement around this show, and the event is shaping up to match expectations. This year, IPC APEX EXPO has 373 exhibitors signed up, and more classes—with better content—in the Professional Development and Technical Conference sections than we can remember. So, in this month’s issue of PCB007 Magazine, we bring you a preview of IPC APEX EXPO 2023.

This month, we bring you articles and interviews with show organizers, committee leaders, and instructors. We even have one article designed to help you justify to your manager why you need to attend this show.

And once you’re on the show floor, stop by and chat with us. We’ll be manning our state-of-the-art I-Connect007 booth throughout the week. Editors and guest editors will be conducting scores of Real Time with… I-Connect007 video interviews with the industry’s top engineers, managers, and executives.

We hope you all have a fantastic holiday season, and hope to see you in San Diego next month. Have a Happy New Year!

Features
On With the Show, by Andy Shaughnessy
Industry Innovation Starts Here, by IPC Staff
Advance in a New Era, by John W. Mitchell
STEM Program: Evolving and Growing, by Charlene Gunter du Plessis
Standards Committees: Moving Faster, Working Better, a conversation with Teresa Rowe
Women in Electronics Reception, by Alicia Balonek
How Networking Opens Doors, by Hannah Nelson
The First India Pavilion, by Gaurab Majumdar
Let’s Get Technical, by Julia Gumminger
Show Floor Highlights, by Alicia Balonek
What’s New in Tech? by Shawn DuBravak
It’s All in the App, by Kim DiCianni
The Value of Training Committees, by Zenaida Valianu
Special Session Sneak Peak, by Julia Gumminger
Reconnecting the Social Network, by Alicia Balonek
Next-level Professional Development, by Julia Gumminger
Launching IPC Community Magazine, by Michele Te

Columns
Revisiting the Art and Science of Photoresist Stripping, by Michael Carano
Coming Back to Life: Design Recovery, by Todd Kolmodin
Basics of Cupric Chloride Etchant, by Chris Bonsell
The Three Essential Ingredients of Reshoring, by Travis Kelly
A Primer on Using Flexible Circuits in Printed Electronics, by Happy Holden

Even as HDI finally moves into the mainstream, UHDI is following right behind. In this issue, we launch the conversation into the strategic value of UHDI technology on the future of the PCB industry. What is UHDI? Why does it matter? What is involved in adding UHDI to your manufacturing portfolio? Are there customers looking for this technology today?

Features

• UHDI: Raising Awareness, and Interesting Questions by Nolan Johnson
• Understanding the UHDI Market interview with Meredith LeBeau and Todd Brassard
• The Growing Need for UHDI interview with Jan Pedersen
• Candor: UHDI Under Development interview with Sunny Patel
• The UHDI Spectrum interview with Matt Kelly
• 3D Electronic Devices with Additive Manufacturing by Shavi Spinzi

Interviews

• MKS Discusses the Cutting Edge of Technology with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick
• ICAPE: Staying on Top During ‘Interesting’ Times with Nathan Martin and Jean-Christophe Miralles

Columns

• Rallying Around a Robust Ecosystem by John Mitchell
• Decision Time: Invest or Delegate? by Todd Kolmodin
• Cupric Chloride Regeneration Options by Christopher Bonsell
• A Day in the Life of a Process Engineer by Paige Fiet
• Palladium as a Final Finish by Happy Holden
• The Next Congress Must Redefine What’s Critical by Travis Kelly

The PCB imaging process has evolved quite a bit over the last six or seven decades, from screening to liquid photoresist to dry film and then to aqueous dry film. Now laser direct imaging has created a world of possibilities that were unthinkable with film.

As we see in this issue, there are many variables to deal with in imaging, making best practices and solid data collection and analysis practices a must. Cost, yield, and quality all depend on a fabricator’s ability to collect and interpret data. So, our experts discuss ways for the readers to fine-tune their imaging process by understanding how printing, etching, plating, and imaging all work together.

Features

• A Clearer Image, by Andy Shaughnessy
• A Sharper Image, a conversation with Loren Davidson
• Direct Imaging Revisited, by Happy Holden
• Optimize Your Etcher for Best Image Quality, by Chris Bonsell
• Web vs. Direct Imaging, by Alexandre Camus, Damien Boureau, and Alexis Guilbert
• Five Priorities for Implementing Direct Imaging, by Brendan Hogan

Columns

• The CHIPS Act is Just the Beginning, by Travis Kelly
• Surface Finish Evolution from Conventional to Advanced, by George Milad
• Retaining Engineers in the Workplace, by Hannah Nelson
• Success in Photolithography Starts With Surface Preparation, by Michael Carano
• Leadership 101: The Law of Explosive Growth, by Steve Williams
• Closing the Innovation Gap, by Chris Bonsell
• Induction Junction, What’s Your Function? by Todd Kolmodin

Article

• Direct Factory Suite: Custom Made, by Stefan Stefanescu

In this issue, we explore ideas for mechanization/automation of your existing facility. At first blush, this theme would suggest a major concentration on manufacturing floor details, or maybe a heavy dose of new capital equipment and line design topics. As you'll learn, it's much more than that.

Features

• The Brave New World of the CTO interview with Alex Stepinski
• A Focus on Process Control interview with Mike Carano
• New Era Manufacturing by Nolan Johnson
• Opportunities in India for Electronics Manufacturing by Dr. John Mitchell
• Let's Make Manufacturing 'Cool' Again by Page Fiet
• How to Automate Your Wet Processes by Chris Bonsell

Articles

• Korf and Strubbe: Material Witnesses interview with Dana Korf and John Strubbe
• ICT Webinar: Your Journey to a Smart Factory by Happy Holden
• Microvias Can Be Stacked in Certain Packages interview with Gerry Partida
• White Paper Excerpt: Next Progression in Microvia Reliability Validation—Reflow Simulation of  PCB Design Attributes and Material Structural Properties During the PCB Design Process by Gerry Partida
• The New World Order of JIC by Dan Beaulieu
• Lessons Learned: Communication Still the Key interview with Kelly Dack

Columns

• Nano-Cu Paste for Microvias by Happy Holden
• Electrodeposition of Copper, Part 3: Plating Distribution and Throwing Power by Mike Carano
• Leadership 101: The Law of Timing by Steve Williams

If you are a fabricator, these are challenging days. But there are also plenty of opportunities available—if you know when to embrace them. This is a good time to analyze your pricing strategies.

Contrary to popular belief, fabricators are in a strong position right now. There are currently fewer than 300 fabricators in North America and companies are willing to pay for a quality, reliable PCB. Washington is even singing our industry’s praises—for now.

In this issue of PCB007 Magazine, our expert contributors will explain how to recalculate your pricing strategies, tune up your sales team and sales processes, and square up your margins.?

Feature Interviews

• Time for a Price Hike? with Dave Ryder and Dan Beaulieu
• Board Pricing Challenges and Opportunities with James Hofer
• ?Price Increases Are Here to Stay with Alun Morgan
• Pricing Strategies with Michael Carano
• FCT: Powerful Growth in the Flex Segment with Carey Burkett

Columns

• Tune Up Your Pricing Strategies, by Andy Shaughnessy
• The Etch Factor, by Chris Bonsell
• With a Little Help from My (IPCEF) Friends, by Hannah Nelson
• Breaking the Void, by Todd Kolmodin
• Update on Inkjet Technologies, by Happy Holden

Article

• What’s Going On in Congress? Your Handy Guide to PCB Legislation Headlines, by Michelle Te

After years of being squeezed by supply chain dynamics, printed circuit board manufacturing is once again growing across the globe. This begs the question: Is now a good time to invest in PCB fab? In this issue, we explore both the market and government forces at play.

Feature Articles

• The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
• An Argument for Investment by Nolan Johnson
• Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell

Feature Interviews

• Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
• Today’s M&A: Right on Target with Tom Kastner
• Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
• PCB Finance Class with Jeff De Serrano
• A Primer on M&A with Tom Kastner
• A Deeper Look at the CHIPS Act Investment with Chris Peters

Columns

• My Time on the IPC Board of Directors: Standing on the Shoulders of Giants by Paige Fiet
• Don’t Sludge-Out: A Guide for Alkaline Etching by Christopher Bonsell
• Caution—Yield Ahead by Matt Stevenson
• Optical Alignment/Coupon Welding for Stackups by Happy Holden
• Electrodeposition of Copper, Part 2 by Michael Carano

Article Reprint

• IPC Thought Leadership: Opportunities for Small- and Medium-sized PCB Fabricators to Compete on the World Stage by Mike Carano with permission from IPC

Even though the plating process itself hasn’t changed much over time, there have been quite a few updates in the plating process, including process control, plating racks, and additives that enhance throwing power. Power supplies have come a long way in just the past decade or so, and newer tanks allow engineers to customize the amount of agitation and solution flow.

So, in this issue, our contributors share a variety of strategies for optimizing today's fabricator's plating processes to carry them into the future. We also take a look at current trends in plating equipment, processes and chemicals, as well as challenges and opportunities for improvement, and areas for eliminating more waste. And we shine a light on measurement and instrumentation. In a segment where measurement is king, why hasn’t the measuring equipment used to analyze the concentration of additives in chip manufacturing been tailored to the PCB segment?

Features

• Proper Plating, by Andy Shaughnessy
• PCB Plating Still Comes Down to Physics, a conversation with Mike Carano
• Plating Offers Plenty of Challenges—and Opportunities, a conversation with Chris Bonsell
• Plating in Electronic Applications, by George Milad
• Plating on Silver: What’s Old Is New Again, by Denis Jacques
• Book Excerpt: Automation and Advanced Procedures in PCB Fabrication, by Happy Holden

Columns

• My Interview With Happy Holden, by Hannah Nelson
• Etchants of the Industry: Cupric vs. Alkaline, by Chris Bonsell
• Radars, Missiles, and the World’s Costliest Computer, by Happy Holden
• Opening New Opportunities in Mexico, by David Hernandez
• ET and the DoD by Todd Kolmodin

Interview

• PCBAA Member Profile: Dan Weber, TTM Technologies

Fabricators need to handle an ever-widening variety of materials and processes, with fewer skilled workers, at a higher level of quality, and without sacrificing turn times. But where to start in updating your capabilities? In this issue we explore potential ROI "golden opportunities” to achieve a quick return on your investment.

Feature Interviews

• The ROI Hotspots with Frank Medina, Jason Perry and Ed Carignan?
• Surveying the Fab Landscape: Where to Find ROI with Torsten Reckert
• ?Chemcut’s Robotic Solution with Bruce Siemering, Neil Robinson and Christopher Bonsell ?
• Candor Nails the ROI With Indubond with Sunny Patel 

Feature Columns

• Golden ROI Opportunities by Nolan Johnson
• How Industry 4.0 Shapes PCB Wet Processes by Christopher Bonsell

Articles

• Webinar Review—A Textbook Look: Signal Integrity and Impedance by Pete Starkey?
• Breaking Down the Materials Market interview with Ed Kelley?

Columns

• How Industry 4.0 Shapes PCB Wet Processes by Christopher Bonsell?
• DoD is Unarmed Without the PCB by Travis Kelly?
• Copper Etchant Regeneration by Happy Holden
• Simple Secrets to Effective Mentorships by Paige Fiet?
• What’s in the Electrical Test Crystal Ball? by Todd Kolmodin

• A Game Plan for Upskilling Your Fab Workforce Interview with David Hernandez 
• Training the Future Manufacturing Labor Force Interview with Sunstone Circuits 
• Book Review: Advocacy by John Daly by Cheryl Tulkoff 
• Addressing the Gap in Process Performance by Nolan Johnson 
• The First Step to Upskilling is FIRST-skilling by Barry Matties
• FIRST Program Inspires Next Generation of Innovators Interview by Barry Matties 
• FIRST: Endorsed by Teachers and Students Alike Interview by Barry Matties 
• Journey to a Smart Factory, an Excerpt by Happy Holden 

• Upskilling Your Staff is Your Best Option by Andy Shaughnessy  
• Working Together to Address Workforce Challenges by John Mitchell 
• Optimize Your Training Time by Todd Kolmodin  
• Prepping for an Internship? Three Tips to Shore up Your Skills by Hannah Nelson 

• The Case for Preventive Maintenance by Christopher Bonsell 
• The Law of Sacrifice by Steve Williams 
• Next-Generation Application Specific Modules by Happy Holden 

Europe is a big market with a great deal of innovation underway in PCB fabrication and assembly. For example, Europe has a leadership role in Industry 4.0 development. It is widely seen as a driving force in sustainability and environmental stewardship. Inside the printed circuit industry, Europe continues to be a ripe incubator for new processes, materials, equipment, and automation solutions. For that reason, we chose to start the new year by focusing on the European market.

Feature Column

• Europe—Taking the Technical Lead on Transition to the Digital Factory by Dr. John Mitchell

Feature Interviews

• Technology and Development Prospects for the European Marketplace with Tarja Rapala-Virtanen
• NCAB Sees Steady Growth with Anders Forsen ?
• An Inside Track on the European Market with Alain Kahn
• ?Cicor Adapts to Changing Market Conditions with Karl-Heinz Fritz 
• ?CLAD Features ‘Truly Disruptive’ Technology with Ralph Birnbaum ?
  

EIPC Special Section

• A Peek Into EIPC’s Technical Snapshot Webinars 
• ?Multilevel Additively Manufactured Electronics: Nulman and Schleicher Elaborate by Michael Schleicher and Jaim Nulman ?
• What is Impacting and Challenging PCB Technology in Europe? by Jan Pedersen ?
• Disruptive Chip Packaging Developments in PCB Fabrication, with Jan Vardaman ?

Columns

• What’s Driving Europe? by Nolan Johnson
• A Voice in Washington for American-Made PCBs by Travis Kelly 
• ?Surface Preparation—The Foundation of the Photoresist Imaging Process by Michael Carano ?
• Semi-Additive Processes and Heterogeneous Integration by Happy Holden ?
• Leadership 101—The Laws of the Picture and Buy-in by Steve Williams ?
• A Report From 2021 (Drop)tronica by Luca Gautero

• Industry Market Drivers, Inflation, and the Supply Chain, with Shawn DuBravac 
• Sarah Czaplewski Discusses the PCB Fabrication and Materials Track 
• Steve Williams Explains ‘AS9100D: 2016 in Plain English’ 
• Technical Track Opportunities, with Matt Kelly 
• IPC Standards Committees: Thoughts on a Changing Landscape, with Teresa Rowe  
• John Mitchell: Focus on the Future
• Francisco Fourcade: Meeting During a Pandemic 
• IPC STEM Event a Real Motivator for High School Students, with Harold Mumford 
• STEM Program on the Grow, with Charlene Gunter du Plessis 
• Meet Drew, a Student With an Interest in STEM by Barry Matties

• What to Expect Regarding COVID Restrictions, by Alicia Balonek  
• Jackie Mattox Keynotes Women in Electronics Reception, by Alicia Balonek 
• Hey Mr. DJ: Trivia Networking Night, by Alicia Balonek 
• Keynotes Educate and Entertain, by IPC Staff 
• Fabricator and Supplier Exhibitor Survey Responses, by PCB007 Staff 
• The Value of Training Committees, by Zenaida Valianu 
• Revving Up Design, by Patrick Crawford

• Direct Imaging: Stitching Together Key Markets With Altix, a conversation with Damien Boureau and Alexandre Camus  
• A Tour of the New Isola Factory: Investing in North America, by Barry Matties 

• Time For a Stroll, by Andy Shaughnessy 
• Photonic Soldering, by Happy Holden 
• Why, Why, Why: Never Stop Questioning, by Todd Kolmodin 
• Plating Anomalies and Defects, Part 2, by Michael Carano

With new inspection technologies and methods, along with AI and advancing data collection, fabricators have new options to consider in their inspection practices. In this issue we look at how new capabilities drive on-floor best practices, and how new best practices are influencing equipment design. We have attempted to answer the following questions:

• What has changed as the dimensions have gotten smaller?
• How does test data start to influence feedback and feedforward loops on the fabrication floor?
• Are there testing techniques that need to be evolved?

• Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products, by William Webb 
• Test and Measurement: Drawing Inspiration from IC Design, by Nolan Johnson 
• The New Electrical Test—Riding the Wave, by Todd Kolmodin

More Content

• Better Electronics Start With Better Training, by John Mitchell 
• Induction Lamination, by Happy Holden 
• The Significance of IPC ENIG Specification 4552 Revision B, by George Milad
• 2021 International Electronics Circuit Exhibition (Shenzhen) Coming December 8–10, by Tulip Gu

• Candor Demonstrates Growth and Investment Go Hand-in-Hand, with Sunny Patel 
• The Truth About Capital Expenditures, with Joe Dickson, WUS Printed Circuit Co. 
• Do You Really Need New Equipment? with Alex Stepinski 
• Direct Imaging and Beyond, with Brendan Hogan, MivaTek 
• Managing Capital Expenditures: Not Just Machines Anymore, with Peter Bigelow, IMI 
• Made in the USA, a conversation with Thomas Walsh and Travis Houchin, IPS 

• CapEx: Spending Money to Make Money, by Andy Shaughnessy 
• Via Filling—Continued, by Mike Carano 
• Tech Talk #1: Vertical Conductive Structures (VeCS), by Happy Holden 
• Leadership 101: The Law of Empowerment, by Steve Williams

When you think about DFM, what’s the first thing that comes to mind?

Most of us immediately think about steps that PCB designers and design engineers should take to ensure that their designs are easily manufacturable by their fabricators. And DFM errors are generally seen as the responsibility of the designer; when the CAM operator finds discrepancies in the BOM, acid traps, and impedance mismatches, he knows who to blame.

As often as designers are blamed for DFM missteps and miscues, fabricators are hardly blameless. Fabricators often fix any DFM issues during the CAM process, thus perpetuating the problem. And fabricators are often reluctant to share their technical capabilities with designers, making communication a moot point.

It turns out that DFM is actually a bi-directional concept, which leads us to our August topic. This month, we asked a variety of contributors to flip DFM around. What does DFM mean from the point of view of the fabricator? Should PCB fabricators share more information about their technology capabilities? What are the fabricators’ responsibilities in this delicate dance?

Features

• A Fabricator’s View of DFM Processes, a conversation with Dana Korf and Mark Thompson
• Designing With the End in Mind—How the Meaning of DFM Will Transform in the Future, by Vince Mazur
• DFM from the Fabricator’s Point of View, a conversation with Joe Clark, Rick Almeida, and Max Clark
• Flex DFM: When All Things Must Be Considered, by Chris Clark
• DFM Surveys: The Readers Speak, by Andy Shaughnessy
• Ucamco Improves Communication With Gerber Job Editor Notes in Mandarin, a conversation with Karel Tavernier ?
• Design for Manufacturing? Don’t Forget Tests! by Todd Kolmodin

Columns

• DFM From the Fab Point of View, by Andy Shaughnessy
• Leadership 101—The Laws of E.F. Hutton and Connection, by Steve Williams
• Jumping the Technology Curve: Collaboration With Your Competition, by Mike Carano
• Holy Cow, What a Lead Time, by Jan Pedersen
• Better by Design—Bringing PCB Design Professionals Together, by John Mitchell
• An Overview of Surface Finishes, by George Milad ?

Articles

• Reasons and Solutions to PCB Lead Times and Price Increases, by Stanley L. Bentley
• One Step/One Bath Copper Through-Hole Fill Pulse Plating Process Across Wide Range of Panel Dimensions, by Nagarajan Jayaraju, et al ?

The world emerges from pandemic disruptions, only to find that markets are out of balance. In this issue we look at the economic conditions and drivers that are shifting supply lines as well as product costs.

Copper is a common theme in this month’s issue, what with a rapidly changing market situation it has become the most important raw material on the planet. In fact, while we were preparing this magazine, China released 100,000 tons of industrial metals including copper, aluminum and zinc from its national reserves to stabilize market prices with more releases to follow as needed. 

Features

• Riding the Wave of Copper Inflation Pricing Interview with Mark Goodwin
• Feeling The Supply Chain Squeeze Interview with Joe D’Ambrisi
• The Demand for Copper Interview with Michael Coll and Chris Stevens
• Economic Drivers Takes Us ‘Up, Up, and Away!’ by Shawn DuBravac
• DFM for Your PCBs Interview with Greg Link
• Navigating Current Market Dynamics Interview with Mark McMeen
• Isola Responding to the Market Interview with Travis Kelly

Feature Columns

• Working Through Shortages by Anaya Vardya
• A Series of Questions on Price Increases by Mike Carano
• The PCB Limbo–How Low Can You Go? by Todd Kolmodin

Columns 

• Inflation and the Changing Supply Chain by Nolan Johnson 
• Leadership 101—The Laws of Respect, Intuition, and Magnetism by Steve Williams

In this issue, we share strategies and techniques for optimizing your manufacturing process, from the business plan to implementation throughout your entire business flow to keep everything running like a top. This includes strategies for training your team and working with your suppliers and customers. We also explore the value in understanding your company’s “greater purpose.”

Features

• Defining Operational Excellence Interview with Todd Brassard
• GreenSource Fabrication on Industry 4.0: A Roundtable Discussion with Alex Stepinski, Robert Zajac and Lukasz Stepien
• Process Optimization in a Business Continuity Plan by Tim McLean
• Operational Excellence from a Design Services Manager Interview with Jesse Vaughn
• A Review of ‘World Class Manufacturing,’ by Nolan Johnson
• Increasing Productivity Through Training by Jahr Turchen
  

Feature Columns

• New Thought Leaders Program Brings Industry Insight by Dr. John Mitchell
• Training Your Team and Tools for Success by Michael Carano
• Optimizing Your Manufacturing Operations by Ray Prasad
• Keep the Tools Sharp by Todd Kolmodin
• Building an Ability to Expect the Unexpected by Raymond Goh

Articles

• Alex Stepinski on Zero-Waste Facilities Interview with Alex Stepinski
• Great Artist Steal: Selecting and Reading the Right Business Books by Dan Beaulieu

Columns

• Operational Excellence by Nolan Johnson
• IPC Education Foundation Lessons Learned by Charlene Gunter du Plessis
• Leadership 101—The Law of Process by Steve Williams

In this issue, as a part of our ongoing series on continuous improvement (X = X_c – 1), we look at manufacturing excellence—from process engineering benchmarking and process life cycles, to reinvigorating your manufacturing infrastructure and strategies for selling your manufacturing capabilities. We investigate critical changes, upgrades, and investments needed to strengthen your business: manufacturing, technical, business, and sales.

Features

• Benchmarking Your Process Engineering Interview with Mark Thompson
• Driving Down Cost With Process Engineering Interview with Matt Mack
• Reinvigorate Your Manufacturing Infrastructure by Mark Goodwin
• Selling for the Best by Dan Beaulieu
• 25 Essential Skills for Engineers Excerpt—Skill Number 7: Project and Product Life Cycles by Martin Tarr with Happy Holden
• Benchmarking for Yield Improvement and Scrap Reduction by Todd Johnson

Articles

• Isola Releases IS550H Material Interview with Michael Gay and Chris Hunrath
• PCB Technologies Expands Capabilities Interview with Arik Einhorn and Ysad Eliya
• Time, Space, Structure, and Model Analysis if CCL Price Increases by Hu Yang

Columns

• Manufacturing Excellence by Nolan Johnson
• Get Familiar with ESG—Environment, Social and Corporate Governance by Dr. John Mitchell
• A Point of Order—Do Not Just Rearrange the Pencils by Todd Kolmodin
• Leadership 101—The Law of Influence by Steve Williams
• Plating Anomalies and Defects, Part 2 by Mike Carano
• Don’t Forget AABUS by Jan Pedersen
• ‘If I Were 20 Years Younger’ by Tom Kastner

In this issue, we begin to map out the new landscape of transportation electronics. Transportation applications will be an active area of innovation in the coming years, as development continues in miniaturization, power management, environmental robustness and infrastructure. Strap in while we explore PCBs in transportation.

Features

• PCB Requirements for E-Mobility Interview with Christian Klein
• The Future is Electric by KJ McCann and Brian Zirlin
• TTM on the Future of Transportation Design by Walter Olbrich
• EV Industry Facing Bottleneck Challenges Interview with Eduardo Benmayor
• Simplified Assembly of Aluminum Flexible Circuits by Tara Dunn
• Process Survivability, Reliability and Robustness Testing for EVs by Bob Neves
• Developing New SIR Standards by Graham Naisbitt
• TLPS Paste-Filled Vias For HF PCBs by Catherine Shearer

Content from Real Time with... IPC APEX EXPO 2021

• Industry Trends—Present and Future with Chris Stevens, Denkai America
• Best Practices for Metallization of Complex HDI Panels with Bill Bowerman, MacDermid Alpha Electronic Materials

Columns

• RAIG (Reduction-assisted Immersion Gold) for Gold Surface Finishes by George Milad
• Homing in on the Target by Todd Kolmodin
• Process Defect Anomalies, Part 1—The Case of Etch Resist Attack by Michael Carano

In this issue, we preview the program and schedules for the upcoming virtual IPC APEX EXPO, as well as continue our exploration of “X = X_c ­– 1” continuous improvement by getting smart about process efficiencies.

IPC APEX EXPO 2021 Special Coverage

• Join Us for IPC APEX EXPO–Virtually by John Mitchell
• Ebullient Trade Events Going Virtual by Jennie Hwang
• Tech Program Interview with Matt Kelly and Chris Jorgensen
• Schedule at a Glance
• Managers Forum Interview with Gene Weiner
• Managers Forum Schedule of Events
• Here We Go (Virtual) Again by Eric Camden
• Membership Has Its Benefits Interview with Brian Knier ­­­
• IPC Education Foundation Update and Looking Ahead by Charlene Gunter du Plessis
• IPC APEX EXPO 2021—Something that Makes Sense by Nolan Johnson

Real Time with... IPC APEX EXPO 2021—5 Things You Need to Know About...

• Solder Masks by Taiyo America
• Direct Imaging by Burkle North America
• Moisture Management by Super Dry Totech
• Manufacturing Training by Blackfox Training

Features

• Do You Have a CPIM? by Barry Matties
• Process Management and Control–Benchmarking Best Practices by Michael Carano
• Our Survey Says: Smart Practices by I-Connect007 Editorial Staff
• Owning your Process by Todd Kolmodin
• Benchmarking Your Suppliers: What to Know About Solder Mask by Bob MacRae
• The Benefits of Statistical Process Control by Kurt Palmer

Articles

• Functional Ink Jet Printing in PCB Manufacture Interview with Luca Gautero
• Quality and Continuous Improvement by Patrick Valentine

Columns

• Attacking the Loophole that Does Not Exist by Jan Pedersen
• Leadership 101—The Law of the Lid by Steve Williams

As we start the new year—what we are calling the year of continuous improvement—it's good to begin with this simple process improvement formula: X = X_c – 1. The tricky part can be deciding what to choose for your first (X). In the early phases of process improvement, the common advice is to start with small improvement projects and grow from there. By doing so, your team will be able to quickly feel and celebrate the success and benefits gained.

Features

• Your Greatest Competition is Yourself by Barry Matties p. 10
• Focus on Smart Processes, Not Just Smart Factories Interview with Todd Brassard, Meredith LeBeau and Audra Thurston p. 12
• 2021: The Year of X = X_c - 1 by Nolan Johnson p. 24
• Mivatek’s New Technology and Market Drivers Interview with Brendan Hogan p. 32
• Finding Process Improvement Opportunities in Training Interview with Leo Lambert p.40

Articles

• What’s Driving Price Increases for CCL and Prepreg? by Mark Goodwin p. 50
• Integrated Optical Waveguides in Printed Circuits by Happy Holden p. 78

Columns

• Continuous Improvement, Smart Processes by Nolan Johnson p. 8
• Getting ‘Lean’ in 2021 by Todd Kolmodin p. 56
• Leadership 101: Leadership is Hard by Steve Williams p. 74
• A Process Engineer’s Guide to Etching Defects–Part 3 by Mike Carano p. 98

In this issue, we consider the perspective of the employer, the seasoned technical professional, and the new-hire engineer. How do these three groups best combine to fill the skills gap that our industry faces? Steven Covey lists one habit in his book The 7 Habits of Highly Effective People that fits the current job market: “If you wish to be understood, seek first to understand.” It is our hope that this month’s content helps job-seeking readers to better understand the employer’s perspective as well as the other way around.

Features

• Millennials and the Seasoned Veterans: Your Future Lies in Both by Dan Beaulieu
• Expert Instructors Share Knowledge with the Next Generation by Dr. John Mitchell
• Hiring and Training: Powerful Insights From Industry Leaders by Nolan Johnson
• The Calumet Files: Interviews With Young Engineers by Todd Brassard
• Hiring is an Investment by Barry Matties
• Training the Force or the Few by Todd Kolmodin
• Training for Plating Processes in the Electronics Industry by George Milad

Articles

• Whiteside’s View from the Summit: An Industry Perspective Interview with Shane Whiteside
• IPC-2581 Rev C Accelerates NPI by Terry Hoffman
• Ucamco Webinar Explores Benefits of Front-end Automation Tool by Pete Starkey

Columns

• Leading by Going the Extra Mile, by Didrik Bech
• Simplify Your QMS Documentation Through KISS, Part 2 by Steve Williams
• A Process Engineer’s Guide to Final Etching by Mike Carano

Vias and Plating

Higher speeds and smaller densities increasingly require different materials, there are smaller fabrication dimensions, and higher aspect ratios in multilayers force the specialization of plating chemistries, too. No one set of solutions can do it all. How does a fabricator choose new chemistry? What is the decision-making process? What should be considered? Find out in this issue.

Features 

• GreenSource Fabrication Creates Plating Flexibility Interview with Alex Stepinski and Rick Nichols
• Making Sense of Plating Chemistries by Bill Bowerman and Rich Bellemare
• The Impacts and Benefits of VeCS Technology Interview with Joan Tourné and Joe Dickson
• IPS Expanding to Accommodate Growing Market by Barry Matties
• Happy’s DIY Solution to Chemical Control by Happy Holden

Feature Columns 

• So Much More Than Just Through Vias by John Steinar Johnsen 
• Don’t Get Pickled by the Barrel by Todd Kolmodin 
• Via Plating for PWBs by George Milad

Articles 

• The Copper Foil Market Is Anything But Flat Interview with Michael Coll
• The HKPCA Previews the Upcoming Trade Show and Convention by the PCB007 China Team 

Columns 

• Vias and Plating by Nolan Johnson 
• Simplify Your QMS Documentation Through KISS, Part 1 by Steve Williams 
• A Process Engineer’s Guide to Final Etching, Part 1 by Michael Carano 

I-Connect007 has been exploring the effect of roadmaps on business planning and operations. We conclude our three-part coverage of the IEEE Heterogenous Integration Roadmap and we explore roadmapping as a tactical tool, not only a long-range strategic plan. This issue's thoughtful, pragmatic, and sometimes philosophical take on roadmapping combines nicely with our discussion of the topic in this month's SMT007 Magazine and Design007 Magazine. Explore them for an expanded view.

Features 

• IEEE’s Heterogeneous Integration Roadmap, Part 3 Interview with Rita Horner 
• Sunstone Circuits Sees Roadmaps as Practical and Collaborative Interview with Matt Stevenson 
• The Acceleration or Deceleration of Change by Dan Feinberg 
• Navigating Around the Future by John Mitchell 
• Roadmap? First, Find the Road! by Todd Kolmodin 

Articles 

• An Update from Taiyo America Interview with Donn Monn
• Advanced Packaging Substrate Metallization Processes in the Age of Heterogeneous Integration by Leslie Kim, et al. 
• Stacked Microvia/Weak Interface Reliability Study Edited by Happy Holden
• IPC Standards Development: Business Challenges and an Inside View by Graham Naisbitt

Columns 

• Roadmaps in Uncharted Territory by Nolan Johnson 
• The Critical Rose of Pretreatment for Plating by George Milad 
• A Process Engineer’s Guide to Surface Prep and Dry-Film Photoresist Adhesion by Michael Carano

We identified four manufacturing pillars: revenue, supply chain, workforce, and technology. In this issue, we examine these four pillars as strategies that affect the manufacturing floor. But in the process, something interesting emerged: the pillars don’t stand on their own.

Features

• The Pillar Roadmap Interview with Happy Holden
• Adopting Inkjet Technology Results Interview with Garrett Harding
• The Building Blocks of Training Interview with Al Dill, Sharon Montana-Beard, Jamie Noland, and Jahr Turchan
• How to Create a Powerful Revenue Engine by Dan Beaulieu
• The Fabrication Supply Chain Is an End-to-End Collaboration Interview with Tim Rodgers

Columns

• The Four Pillars of Manufacturing by Nolan Johnson
• Pillars of Mil-Aero Technology and Revenue by Mike Hill
• A Path to Successful PCB Fabrication by Didrik Bech
• Communication Goes Both Ways by Tara Dunn
• A Process Engineer’s Guide to Interconnect Defects by Michael Carano
• Immersion Plating Reaction in Electronics Manufacturing by George Milad

Technical Article

• ENIG: Corrosion and Learning From Failures by Britta Schafsteller, et al.

Happy Holden Presents: Special Coverage From IPC High-Reliability Forum

• 2020 IPC High-Reliability Virtual Forum Review
• Denny Fritz Unpacks Weak Interface and Stacked Microvia Reliability
• Gerry Partida Emphasizes Current Concerns Over Microvia Failures

Leadership

Leadership is the foundation of a successful business. There's an art/philosophy to it, but there's also a science/method to leadership. In this issue, we explore both sides of leadership and its impact in the electronics industry and beyond. In preparation for this magazine, we conducted a survey on leadership. Much of what the survey participants revealed confirms our usual beliefs, but there were some surprising insights among the data as well.

Features

• Thoughtful and Nimble Leadership at Calumet Electronics Interview with Todd Brassard and Meredith LeBeau
• Navigating the Challenges of the New Normal by Kevin Jobsky
• 3 Tools That Should Be in Your Leadership Toolbox by Dr. John Mitchell
• Don’t Be a Boss: Be a Leader by Todd Kolmodin
• Leadership Styles for Success by Didrik Bech
• Creating Energy in Leadership: IPC Opportunities for Emerging Engineers by Teresa Rowe

Columns

• Leadership in Today’s World by Nolan Johnson
• Leadership Lessons I Learned From Sonny Barger by Steve Williams
• A Process Engineer’s Guide to Electroless Copper by Mike Carano

Articles

• I-Connect007 Survey on Leadership: More Important Now Than Ever by Michelle Te
• Blue Box: Leading a Cleaning Revolution interview with Jim Metropoulos
• Palladium Plating Increases Robustness, Lowers Cost by Britta Schafsteller, et al.
• New Laser Method for PCB Depaneling Increases Process Utilization by Frank Gäbler

During the COVID-19 outbreak, market dynamics may be changing the calculus on regional and captive fabrication and capital investment. Businesses throughout the industry are rethinking their manufacturing, cybersecurity, and supply chain strategies. This issue is an exploration of the rethinking currently underway across the industry. Our conversations on rethinking manufacturing include reimagining wet processes, additive, and subtractive processes. We also explore rethinking the tools available to your incoming CAM department, in the form of best practices for landing pads, the advantages of the new VeCS technology, and much more.

Features

• Cyberattack! Think It Couldn’t Happen to You? Think Again! An interview with Eric Cormier and Dave Ryder
• A Lasting COVID-19 Lesson: Resilient Regional Manufacturing Networks by Dr. John Mitchell
• Rethinking Captive Manufacturing An interview with Alex Stepinski
• Atotech Looks to Expand Product Portfolio An interview with Andreas Schatz and Daniel Schmidt
• Atotech: A System Supplier With Total Solutions by Happy Holden
• Rethinking Interconnects With VeCS Technology An interview with Joe Dickson
• Simulation Technology in Acid Copper Pattern Plating An interview with Robrecht Belis

Columns

• Rethinking Manufacturing by Nolan Johnson
• Too Much Automation? by Todd Kolmodin
• Additive and Subtractive: When Opposites Attract by Tara Dunn
• A Process Engineer’s Guide to Advanced Troubleshooting, Part 2 by Michael Carano
• 7 Steps for MIL-PRF-31032 Certification by Mike Hill
• Guerilla Tactics to Pass Any QMS Audit, Part 4 by Steve Williams
• LED UV Cure: Does It Really Work? By Marc Ladle

All of the 12 people on the front cover this month’s issue were influential in promoting total quality management. TQM is a business management methodology where employees are empowered to improve processes—and therefore, product quality—continuously. In this issue, we discuss TQM as a means to manage change and continuous improvement in your business.

Features

• Lessons Learned From Past Applications of TQM An interview with Dan Feinberg
• Focus on the Impact of Data An interview with Dana Korf
• Emotional Manufacturing Intelligence An interview with Steve Williams
• W. Edwards Deming’s Lost Chapters Recovered by Happy Holden
• The Importance of Quality Management by Didrik Bech

Columns

•  Are We Back to TQM? by Nolan Johnson
• Minimizing Signal Transmission Loss in High-Frequency Circuits by George Milad
• Guerilla Tactics to Pass Any QMS Audit, Part 3 by Steve Williams
• A Process Engineer’s Guide to Advanced Troubleshooting, Part 1 by Mike Carano

In the blink of an eye, priorities can change. In January 2020, the industry was enjoying a sustained growth path, but that was a very different 2020 than the one we live in today. While it’s too soon to say what will be our new equilibrium, in this issue, we explore how priorities have changed.

Features

• Rogers Corporation Keeps Materials Moving Interview with Roger Tushingham
• Down-shifting to the New Normal by Todd Kolmodin
• PCB Prototyping During a Pandemic by Matt Stevenson
• It’s the Little Things by Tara Dunn
• An Optimistic Look at Resource Optimization Into the Future by Paul Benke and Michaela Brody
• It’s All About Being Prepared by Raymond Goh
• The Rush to Remote Work: Amid COVID-19, Businesses Fail to Employ Necessary Safety Nets by Ken Michael

Articles

• Characterization of Advanced Interconnect Technology by Brandon Sherrieb and Steve Karas
• Plasma Applications in the PCB Industry by Nikolaus Shubkegel

Columns

• What Are Your Priorities Now? by Nolan Johnson
• Separating Hype From Reality: What’s Next for the Future of Electronics? by Dr. John Mitchell
• MIL-PRF-31032 Offers a Rewarding Twist by Mike Hill
• Can ‘Nickel Corrosion’ Occur in ENEPIG? by George Milad
• Guerilla Tactics to Pass Any QMS Audit, Part 2 by Steve Williams
• Lamination and Delamination by Mike Carano

The Impact of COVID-19

The global population reacts to a viral threat. The electronics manufacturing industry moves to the center of the response even while individuals find new ways to work safely. This issue of PCB007 Magazine brings you select news and updates on how our industry is responding and contributing to this fight.

Features:

• Electronics Industry Advancements Have Prepared Us for COVID-19 by John Mitchell
• Our Finest Hour by Dan Beaulieu
• A Sustainable Supply Chain for Lowest Total Cost by Harry Kennedy
• Supply-chain Recovery: Plan for Now and the Future by Steve Williams and Fane Friberg
• Advances in Medical Diagnostics Using LoC and LoPCB Technologies by Pete Starkey and Happy Holden
• COVID-19: Economic and Microelectronics Industry Impacts—Insights From McKinsey & Company by Michael Hall

Feature Interviews:

• Dr. John Mitchell: IPC’s Ongoing Efforts Related to COVID-19
• IPC’s Dr. Shawn DuBravac: COVID-19 Global Industry Update
• Isola’s Travis Kelly: Maintaining Continuity of Supply
• Freedom CAD’s Scott Miller: Taking Care of Customers and Staff
• Gene Weiner: Lessons Learned From COVID-19
• Dave Bergman and Teresa Rowe: IPC Standards Work Continues to Move Forward
• Dan Beaulieu: Business as Usual at D.B. Management
• Mentor’s Oren Manor on Automation Business Adjustments
• Matt Stevenson on Sunstone Circuits’ Current Operations
• EMA President Manny Marcano: Software Tools Are Essential

Article:

• Improving Copper Distribution in Pattern Plating Using Simulation Software by Pete Starkey

Columns:

• It’s Not Easy Being Green (or Is It?) by Todd Kolmodin
• Conductive Anode Filament (CAF) Formation by Michael Carano
• Can Better Guidelines on Cosmetic Failures ‘Save’ Functioning PCBs? by Jan Pedersen

Profitability is a multi-faceted subject. Today, there are still opportunities left in the PCB fabrication business to regain profit margin—some large and systemic, others small and incremental. One must make the choice to think differently about the business–and processes–to restore profitability.

Features

• Profit Is in Your Thinking An interview with Steve Williams
• The Business Case for Metallization An interview with Bill Bowerman
• Finding Profitability in the Drill Room An interview with Dick Crowe, Kurt Palmer, and Thomas Kunz
• Waste Not, Want Not by Todd Kolmodin
• Trends in PCB Processing: A New Set of Technologies, Materials, and Challenges by Patrick Riechel and Shane Noel
• PCQR² Tool: A Scorecard for Suppliers? An interview with Al Block and Naji Norde
• The Advantages of Developing, Processing, and Using an Inkjettable Solder Mask by Chris Wall
• Eliminating Waste From Electrolytic Acid Copper Plating by George Milad

Articles

• The Co-evolution of Carbon-based Direct Metallization Alongside HDI Technology by Graham Lee, et al.
  
• Dream Big: 2019 PCB Global Executive Forum by Tulip Gu
• When Your Fabricator Is Late An interview with John Watson

Columns

• Have You Hugged Your Technical Review Board Lately? by Mike Hill
• The Current State of VeCS Reliability An interview with Joe Dickson
• Profitability Is a Choice by Nolan Johnson
• The Future of the Electronics Industry by Dr. John Mitchell
• Guerilla Tactics to Pass Any QMS Audit, Part 1 by Steve Williams
• Material Challenges for PCB Fabricators by Mike Caran

There need to be benefits to any change—and transforming the manufacturing floor into a digital factory is a big change indeed! In this issue of PCB007 Magazine, we look at some of the advantages that can be realized as new Industry 4.0 capabilities become available.

Features                     

• The Smart Factory: All the Bits and Bobs by Happy Holden
• Agfa Advances in the Inkjet Environment by Pete Starkey
• Industry 4.0 Data for Legacy to Modern Machines An interview with Tim Burke
• One-year ROI: Smart Factory Implementations An interview with Michael Ford
  
• What Are the True Benefits of Going Digital? by Didrik Bech
• Looking at Digital With 11111100100 Vision by Todd Kolmodin

Articles

• XRF: An Essential Tool to Help PCB Manufacturers Meet IPC Specifications by Matt Kreiner
• The Direction of MacDermid Alpha’s Automotive Initiative An interview with Lenora Clark
• The Current State of Embedded Active Components An interview with Chris Ryder
• Short: Alex Stepinski: GreenSource Fabrication Update by Barry Matties
• PCB Surface Preparation Before Solder Mask on Non-copper Finishes by Nikolaus Shubkegel

Columns

• The Benefits of Going Digital by Nolan Johnson
• Three Workforce Lessons From Manufacturing Plants Around the World by Dr. John Mitchell
• Via Hole Filling and Plugging, Part 3 by Mike Carano
• The Founding Fathers of Quality: Ishikawa and Shewhart by Steve Williams

IPC APEX EXPO is here again. I-Connect007 has been previewing IPC APEX EXPO all month, and we’re excited to bring the highlights you can expect to see while in San Diego.

In this issue, Brook Sandy-Smith, IPC technical conference program manager, gives a detailed overview of what attendees can expect in the technical sessions, as well as some new and reconfigured events and resources on the technical conference side. Randy Cherry, IPC Validation Services and Chris Mitchell, IPC’s Government Relations Team weigh in with their insights on what to expect at this year’s show.

Features                     

• Engaging STEM Students at IPC APEX EXPO 2020 by Nolan Johnson
• IPC Government Relations Team Offering Education and Fun at IPC APEX EXPO 2020 by Chris Mitchell
• IPC Validation Services: What to Expect at IPC APEX EXPO 2020 Interview with Randy Cherry
• GreenSource Fabrication Update Interview with Alex Stepinski
• IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection by Brook Sandy-Smith
• IPC APEX EXPO Technical Session Preview Interview with Brook Sandy-Smith
• Celebrating 20 Years, IPC APEX EXPO Recognizes Exhibitors by IPC Staff

Feature Columns

• IPC APEX EXPO 2020: A Special Anniversary Year by Dr. John Mitchell
• Automotive Standard Elevates the Excellence of Electronics by Jan Pedersen
• Additive PCB Technology for Next-generation Electronics by Tara Dunn

Columns

• Sampling Plan Language in MIL-PRF-31032 by Mike Hill
• Technology Trends and Direct Metallization by Michael Carano
• EPIG: A Nickel-free Surface Finish for Next-generation Products by George Milad
• The Founding Fathers of Quality: Juran and Crosby by Steve Williams

Bonus Content:

• Videos: Viking Test Walking Tour and UV Curing Discussion with Jake Kelly and Marc Ladle
  
• Streamlining Inspection and Verification Interview with Vladi Kaplan

Our theme this month is “What You Need to Know,” and what we learned as we put this issue together is that there is a lot you need to know as a printed circuit fabrication professional. We bring you some selected categories of critical PCB fabrication expertise, plus some bonus coverage from productronica 2019 in Munich.

Features                                

• New Trends in the PCB Industry at productronica 2019 by Jan Pedersen
• What You Need to Know About Reducing Lamination Time Interview with J. Ziomek and T. Faraci
• Never Stop Learning by Michael Carano
• Staying in Your Lane by Todd Kolmodin
• PCB Manufacturing from a European Perspective Interview with S. von Bargen and H. Anac
• Planning a Successful Technical Conference Interview with Amanda Lange

Columns

• What You Need to Know by Nolan Johnson
• Rising Tariffs Put a Painful Squeeze on Electronics Manufacturers by Dr. John Mitchell
• New Developments in ENIG by George Milad
• The Founding Fathers of Quality: W. Edwards Deming by Steve Williams

Articles

• Process Control Essentials in the Plating Line Interview with Rick Nichols
• CML Poised to be ‘More Than a Manufacturer’ Interview with Chris Minard
• Wi-Fi 6: Wired vs. Wireless by Dan Feinberg

In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view. With each interview, try on another outlook and look at the industry from another point of view.

Feature Interviews

• Tarja Rapala-Virtanen on Changing PCB Demands
• A Young Engineer’s Perspective on Joining the Industry Interview with Audra Thurston
• Sunstone Circuits on Staffing Trends in the Digital Age Interview with Nancy Viter and Sheri Kuretich
• Thomas Michels on the Importance of Investment and Cooperation
• Industry Set for Shift to True 3D Printing and Photonics Interview with Zach Peterson
• Chasing Down Materials for 5G and Beyond Interview with Johnathan Rountree

Articles

• Industry Wind Vane: Future Development Through the 2019 HKPCA Show by the PCB007 China Team
• 5G Is Coming With Quantum-level Advances and Features by Dan Feinberg
• The CPCA and China’s Electronic Circuit Industry: Past and Future by Wang Longi
• The Viability of a Cyanide-free Immersion Gold Bath by Rick Nichols, et al.

Columns

• Clarity of Vision by Nolan Johnson
• Go to Bed Hungry by Todd Kolmodin
• Making Quality Initiatives Fun by Steve Williams
• UV Cure LED Energy Saver by Marc Ladle
• Changes and Concerns Regarding HDI Technology by Mike Carano

For printed circuit fabricators, the terrain continues to change. While automation is a key part of our transformation, human expertise and problem-solving remain central to the process. This issue considers the current, ever-changing landscape of our industry, from global economics to emerging technologies and processes that may change how the manufacturing floor operates.

FEATURES

• Asleep at the Wheel? by Nolan Johnson
• Chinese Review: The 2018 NTI-100 Top Global PCB Fabricators by Yonglin Gong
• The Laminate Market: What Will the Future Bring? by Raymond Goh

Articles

• Multilayer Press Technology Using Magnetism to Produce Lamination Heat by Víctor Lázaro Gallego
• Solder Mask Tack Dry by Nikolaus Schubkegel
• Vertical Conductive Structures, Part 4: Tuning Your Signal Performance by Joan Tourné

Columns

• Opportunities for Learning Abound at IPC by Dr. John Mitchell
  
• Technology and Reliability Demands Drive Designers and MIL-PRF-31032 Specification by Mike Hill
• Additive Electronics Momentum by Tara Dunn
• Via Hole Filling and Plugging, Part 2 by Michael Carano

The flag standard became the symbol of the “rule of law” and a rallying point for those who supported that particular institution. It’s no small wonder, then, that the term has expanded to include other systems that function as law by mutual agreement. The process of reaching that agreement can be a long, arduous road to travel. In this issue, we look at standards both as processes and rallying points.

Features                     

• Is It Time to Shake Up Materials Standards? interview with Mark Goodman and Alun Morgan
• Using Industry Standards as Another PWB Manufacturing Tool by Marc Carter
• Standards: Why We Have Them and Live by Them by Alifiya Arastu, Jeffery Beauchamp Harry Kennedy and Ruben Contreras
• Understanding the Fine Print by Todd Kolmodin
• The Future of ‘Substances and Materials in Products’ Data Exchange Formats as Standards by Jean-Pierre Theret
• The Past 15 Years: Changes to MIL-PRF-31032 Certification, Part 2 by Mike Hill

Articles

• New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications by Juha Saily

Columns

• Carrying the Flag by Nolan Johnson
• Maintaining a Strong Economy Through Workforce Development by Dr. John Mitchell
• Working With Flexible Circuits by Mike Carano

In this issue, we explore the processes and chemistries that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollution, higher throughput, and improved reliability as they relate to wet processes and plating. Further, we address some of the emerging processes for higher performance designs and new equipment to implement modern techniques.

Features

• The State of Plating by Marc Ladle
• Chemcut: Wet Processing Equipment for the Long Haul Interview with Rick Lies and Jerry Reitz
• Putting Green Into a Brownfield Facility Interview with George Milad
• The Advantages of Non-sludge Acid Copper Products Interview with Mike Wood
• Pollution Prevention Techniques: Rinse Water Reduction by Happy Holden

Articles

• Innovative Electroplating Processes for IC Substrates by Saminda Dharmarathna, et al.
  
• SAP Utilizing Very Uniform Ultrathin Copper by a Novel Catalyst by Steve Iketani and Mike Vinson
• Vertical Conductive Structures, Part 3: Design Tool Techniques by Ed Hickey, Mike Catrambone, and Joan Tourné
• Solder Mask Curing: UV Bump Overview by Nikolaus Schubkegel

Columns

• There’s An Art to Plating by Nolan Johnson
• CFX and Hermes: The Plug-and-Play IPC Standards Building Momentum for Industry 4.0 by Dr. John Mitchell
• Via Hole Filling and Plugging, Part 1 by Mike Carano
• The Past 15 Years: Changes to MIL-PRF-31032 Certification, Part 1 by Mike Hill

Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Medical devices will be relied upon to keep us living in many more situations. Autonomous vehicles will need to be failure-free to keep riders and pedestrians alike safe in the world. IoT will bring opportunities to put smart electronics in new places, performing unthought-of ways. Reliability will be crucial to both our success and safety.

Features

• Microvias: Links of Faith Are Not Created Equal by Jerry Magera and J.R. Strickland
• Interconnect Reliability Correlation With System Design and Transportation Stress by Dr. Paul Wang, Vincent Weng, and Dr. Kim Sang Chim
• How Changing Cleaning Technologies Affect Reliability An interview with Mike Konrad
• A Guide to High-reliability PCBs From Design to Specification by Jeff Beauchamp
• Avoiding CAF Failures at the IPC High-reliability Forum An interview with Terry Munson
• How to Feed Test Data Back to Engineering for Process Improvement by Todd Kolmodin
• Focusing on Surface Sensitivity for Reliability An interview with Elizabeth Kidd and Alex Bien

Feature Columns

• Reliability... It's All About the Landing, by Nolan Johnson
  
• What Do You Mean “Passed” Isn’t Enough? by Todd Kolmodin
• A Conversation with Prototron’s Van Chiem by Steve Williams
• When You Do Everything Right and Something Still Goes Wrong by Tara Dunn
• Avoid Failures in PCB Production With Compliance Control by Didrik Bech

Columns

• Moving Into Microvias, Part 4 by Mike Carano
• Sunday Afternoon in Dongguan by Marc Ladle

According to a press release published by SCORE on May 23, 2019, “98.6% of American manufacturing companies are small businesses, and 75.3% of those businesses have fewer than 20 employees.” SCORE is an organization that mentors to America's small businesses. The report continues, “Last year, manufacturing businesses generated 11.6% of the U.S. economic output and employed 8.5% of the U.S. workforce, but 89% of manufacturers report that they cannot fill all job openings.”

This report looks at all manufacturing, but it’s clear that the electronics industry trends are consistent with manufacturing in general. There are also a large number of small businesses in our sector.

Our topic this month, however, is “Everything Starts With Design,” so what does that have to do with quality, staffing shortages, or small business? Pretty much everything.

As OEMs drive electronics manufacturers to improve processes to simultaneously build a product at two orders of magnitude more reliability, where does a fabricator even begin to concentrate its efforts to get the best improvement in output? Some will tell you that getting the best possible quality on the input is where you should start.

The design team’s files and the accompanying documentation is the real-world implementation plan to turn the OEM’s concepts and marketing research into a viable, physical, competitive product. Unless manufacturing defies the build instructions from the designers, the product will only be as manufacturable as the design files themselves. The higher the quality of the design, the more robust the contingencies specified in the bill of materials, and the more materials tolerances have been thought through and expressed in the build notes, the better the end result will be coming through fabrication.

And given all of the simultaneous challenges facing PCB fabricators with respect to staffing, new equipment, environmental impact, etc., making the communication process with your OEM customers efficient seems like the logical first step in stepping up to new challenges.

Features

• Digital Twin Drives Design in the Smart Factory by Happy Holden
• Identifying Product Board Class and Pre-quote Software An I-007eBook Excerpt
• Technically Appropriate Material Choices Are Key to Design Success An interview with Mike Creeden
• Spark an Idea by Tara Dunn
• From Wooden Huts to Homemade Go-karts: It All Starts with Design! by the PCB Norsemen

Articles

• Virtual Verification Station From CIMS Enhances AOI Capabilities An Interview with Vladi Kaplan
  
• Kelvin Characterization to Accurately Predict Copper Thickness by Brandon Sherrieb
• Conventional Exposing: Direct Imaging Solder Mask by Nikolaus Shubkegel
• Vertical Conductive Structures, Part 2: VeCS and Micro-machining by Joan Tourné

Column

• Emerging Engineer Program: A Unique Opportunity Offered by IPC by Dr. John Mitchell

In the May issue of PCB007 Magazine, first, we lay down some high-level perspective on materials starting with Alun Morgan’s perspective on the future of PCB materials. Then, columnist Tara Dunn writes about “New Materials or New to You?” Next, we have a conversation with Panasonic’s Tony Senese on megatrends in materials. These three pieces deliver a panoramic primer on materials, opportunities, activity, and global economic forces at play in the market.

Then, our conversations get more specific, including discussions with John Andresakis and Jonathan Weldon from DuPont; Ken Parent from Insulectro; TUC America’s Alan Cochrane; Sean Mirshafiei from Isola; and a second conversation specific to Panasonic materials with Tony Senese.

Interspersed, you’ll find columns from Dr. John Mitchell on industry outlooks, Jan Pedersen on traceability and reliability, Steve Williams on training new employees, Todd Kolmodin on probers and testers, and Mark Ladle takes us on a brisk, poignant customer visit as a traveling engineer.

In addition, we’re proud to bring you a tour of Microtek Labs’ Chinese facility. Barry Matties and Edy Yu from the I-Connect007 China team spoke with Bob Neves about growing a business in China.

This makes for quite a stack of information on materials. What we learned—and hope you will take away as well—is that understanding the current trends in materials will require everyone from designers to material manufacturers and the entire manufacturing chain to talk, collaborate, and listen to each other to best master these new materials in the real world.

Features

• Alun Morgan on the Future of PCB Materials Interview by the I-Connect007 Editorial Team
• Making Materials Succeed: Past, Present, and Future Trends Interview with Tony Senese
• DuPont on Materials Challenges and New Opportunities Interview with John Andresakis and Jonathan Weldon
• Insulectro’s OEM Program: Time to ACT! Interview with Ken Parent
• Laminate Suppliers Face Increasing Demands from Customers Interview with Alan Cochrane
• Isola on Adapting Processes to Meet Customer Needs Interview with Sean Mirshafiei
• Creating Stability in Materials Chaos Interview with Tony Senese
• New Materials or New to You? by Tara Dunn

Columns

• IPC Pulse Survey Shows Positive Industry Outlook Continues but Varies by Region by Dr. John Mitchell
• What Is Reliability Without Traceability? by Jan Pedersen
• Help Wanted! How to Train New Employees in Today’s Digital World by Steve Williams
• The Evolution of Probers and Fixture Testers: Blinded by Science by Todd Kolmodin
• The Travelling Engineer, Instalment 2 by Mark Ladle

Bonus Article

• Microtek Labs: Providing Trusted Testing in the Chinese Market Interview with Bob Neves
  

The acceptance of smart factories is a global movement across multiple industries. In electronics manufacturing specifically, China seems to be a key leader in the move to Industry 4.0. Once seen as an industrial heavyweight that depended on a huge labor pool, the environment in China has transformed. Chinese culture has a history of adaptability, and China’s industry-leading implementation of Industry 4.0 concepts is demonstrating that essential skill to the globe once again. What stands out about the Chinese transition is that automation—robotics, in particular—is a surprisingly small part of the whole solution. Our March issue of SMT007 Magazine includes interesting articles based on our recent visit to two Chinese PCB smart factories. You'll find direct links to those articles in this issue.

We start off this month with “The Smart Factory IQ Test” where you can quiz your conceptual Industry 4.0 knowledge. Next, Barry Matties visits Ventec International Group’s China-based facility. Laminate isn’t considered a high-mix, low-volume business—especially in China—but that’s exactly Ventec’s approach.

From people to technology, I-Connect007 Technical Editor Happy Holden and factory automation pioneer posts an overview of the “Hardware and Software in Smart Factories.” The PCB Norsemen consider smart factory technologies and the move into implementation around the globe, and Steve Williams discusses the key elements making up Industry 4.0 technologies.

Dr. John Mitchell, IPC president and CEO, introduces the IPC Education Foundation in his column, which is a 501c(3) organization to assist students and the emerging workforce.

Tara Dunn shares an example of doing business that serves as a great metaphor and reminder. The real smarts in any factory are—and will continue to be—the people who perform the most complex, heuristic analyses of all. Read her column titled “Old-fashioned Networking.”

In “Optimizing the OSP Processes for High Performance,” Michael Carano discusses organic solderability preservatives (OSPs). Todd Kolmodin’s column dives into creating “Confidence in Inspection” with a discussion of third-party inspection. And Mark Ladle, “The Travelling Engineer,” shares an anecdote about his initial experiences traveling overseas as a field engineer.

Returning to China, we bring you a report from the 2018HKPCA & IPC Show in Hong Kong. Mr. Hu Yang provides an overview of how the Chinese domestic market is developing and changing the fabrication industry.

Features

• The Smart Factory IQ Test A Quiz by Nolan Johnson
• Ventec Focuses on High-mix Manufacturing by Barry Matties
• Hardware and Software in Smart Factories by Happy Holden
• Smart Factories: More than Just Robots by Nolan Johnon
• A PCB Broker’s Guide Through the Galaxy of Automation by the PCB Norsemen
• The New Frontier of Manufacturing by Steve Williams

Columns

• Have You Heard About the New IPC Education Foundation? by Dr. John Mitchell
• Old-fashioned Networking by Tara Dunn
• Optimizing the OSP Process for High Performance, Part 1 by Michael Carano
• Confidence in Inspection by Todd Kolmodin
• The Travelling Engineer, Instalment 1 by Mark Ladle

Article

•  An Overview of the PCB Industry: 2018 HKPCA & IPC Show by Hu Yang

Things are changing in our industry, so is it any surprise that how you sell your services is changing too? If your sales approach seems out of focus, then join us as we look at some successful PCB selling and marketing strategies including staffing, hiring, branding, and more. Bring your sales channel into sharp relief.

Feature Articles

• Dan Beaulieu on Magnetic Marketing: A Conversation with Barry Matties
• NCAB Group Builds Sales on Relationships and Expertise, Interview with Wayne Antal
• How Emerging Technologies Should Impact Your Sales Strategy, Interview with Terry McNabb
• SMART Marketing by Barry Matties
• Matt Stevenson Discusses Online Quoting and Ordering by the I-Connect007 Editorial Team

Feature Columns

• Selling Has Changed: Have You Changed How You Sell? by Nolan Johnson
• Become an IPC Workforce Champion by Dr. John Mitchell
• The More Things Change, the More They Stay the Same by Tara Dunn
• Branding: A Small-business Perspective by Steve Williams

Columns

• 2019 Copper Development and Onward by Didrik Bech
• Moving into Microvias, Part 4 by Michael Carano

Understanding the ripple effects in the electronics supply chain will be key to manage the supply chain crisis and keep your fabrication facility running smoothly. In this issue, we bring you timely conversations with industry experts to help position your company’s offerings to the greatest effect.

Features

• Stephanie Martin: Component Supply Challenges from the Catbird Seat by the I-Connect007 Editorial Team
• NCAB Group on Supply Chain Issues: An Interview with Wayne Antal by Nolan Johnson
  
• Perspectives on Supply Chain Ripples by Nolan Johnson
  
• Mil/Aero Markets Column: The Fourth Pillar of Defense Acquisition: Cybersecurity by John Vaughan

Articles

• Interview: Roger Bernards on MIDs and Automotive by Happy Holden
• Interview: Aismalibar on Thermal Management Substrates and Automotive by Nolan Johnson
• Chemical Recycling as Part of a Zero-effluent Strategy by Happy Holden

Columns

• Nolan’s Notes: Reflections on Supply Chain Issues by Nolan Johnson
• Ladle on Manufacturing: VCP: The Future of Plating by Marc Ladle
• Trouble in Your Tank: Moving in Microvias, Part 3 by Mike Carano

There’s no better place to participate in the  excitement and innovation of the printed  circuit industry than at IPC APEX EXPO 2019. We preview the show, events, exhibitions, new technologies, awards, competitions, and standards work. Experience the magic that is our  industry with IPC APEX EXPO. So, relax and make your travel plans as we give you the big reveal!

FEATURES:

• IPC APEX EXPO 2019: Where Technology’s Future Comes Together by John Mitchell
• IPC APEX EXPO 2019 Schedules, Stats, and Programs by Nolan Johnson
• Shopping at IPC APEX EXPO: Evolutionary or Revolutionary Products? by Andy Shaughnessy
• Dan Beaulieu on Making the Most of a Trade Show Interview by Barry Matties
• IPC APEX EXPO 2019 Offers a Full Operating CFX Demo Line, an interview by the I-Connect007 Editorial Team
• Tara Dunn Shares Strategies for Today’s PCB Business, an interview by Barry Matties
• Mark Friedman on IPC Membership, an interview by Barry Matties
• In the Studio: Real Time with...IPC by Andy Shaughnessy
• IPC Recognizes Volunteers at Awards Luncheons by Patty Goldman
• Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics by Patty Goldman
• Get Ready for the Unveiling! by Nolan Johnson
• Technology’s Future Comes Together: A Great Slogan for Us All! by Jan Pedersen
• Averatek to Present Two Papers at IPC APEX EXPO 2019 by Tara Dunn

ARTICLES & COLUMNS:

• Strategies to Manage Your China Business Through Turbulence by Philip Carmichael
• Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability? by Andrew McManus
• Industry 5.0: Can We Learn From Other Industries? by Steve Williams
• Surface Preparation and Cleaning, Part 3 by Michael Carano

Of the driving forces in the PCB manufacturing marketplace today, one major contributor is medical device technology. Medical device development is influencing materials, components, manufacturing techniques, and procurement. In this issue, we investigate innovations surrounding the medical sector.
TABLE OF CONTENTS:
Features:

• Emerging Medical Technologies: What to Watch For, A Compilation by I-Connect Editorial Staff
• FDA Approval: A Vital Step in Medical Manufacturing, by Nolan Johnson

Columns and Articles

• Flex Talk: FlexFactor: Imagination and Innovation, by Tara Dunn
• The PCB Norseman: PCB Standards for Medical Device Applications: A Hard Nut to Crack!, by Jan Pedersen
• The Right Approach: Star Trek Inspires Medical Technology: An Update, by Steve Williams
• Interview: Dock Brown on Succeeding at Failure Analysis, by Barry Matties and Happy Holden
• Trouble in Your Tank: The Art and Science of Resist Stripping, Part 2, by Mike Carano
• Via Fill and Through-Hole Plating Process with Enhanced TH Microdistribution, by Mikolova, et al.
• Inspire the Industry, Explore the Infinity: 2018 HKPCA & IPC Show Preview, by PCB007 China Editorial Team

GreenSource Fabrication, a New Hampshire division of Whelen Engineering, is rolling out an expanded facility that can claim to be the most advanced automated PCB facility in North America. It’s also zero waste and zero effluent. Take a detailed tour of the facility as we talk to the designers, staff, and equipment suppliers collaborating to make this facility a reality.

Features

• GreenSource Fabrication: Looking to The Future | Interview with Alex Stepinski
• Innovative PCB Processes are Lean and Green | by Happy Holden
• Atotech Brings World-Class AHDI to the U.S. | by the I-Connect007 Editorial Team
• Schmoll and Burkle Automation Technologies: Lasers and Drills for GreenSource | Interview with Dave Howard
• Automation Attracts the New Guard to PCB Fabrication | by the I-Connect007 Editorial Team
• InduBond Takes on The Lamination Process at GreenSource Fabrication | Interview with Víctor Lázaro
• CIMS AOI Solutions: Truly Creativity in Motion | Interview with David Ravino
• How GreenSource is Fine-Tuning the Processes, Right Down to Account Management | Interview with Jim Brown
• AWP Group: Small Company, Big Solutions | by the I-Connect007 Editorial Team
• Circuit Connect and Green PCBs: Bringing Business Back to New Hampshire | by Nolan Johnson
• In the Analytical Lab at GreenSource | Interview with Mark Chasse

Columns

• GreenSource: The Future | by Nolan Johnson
• The Art and Science of Photoresist Stripping, Part 1 | by Michael Carano
• IPC Legislative Victories Reached with Outstanding Member and Industry Support | by John Mitchell

PCBs are approaching semiconductors with regard to feature sizes. Given this growing trend that shows no signs of slowing down, our experts this month are helping us understand substrate-like PCBs (SLP) and the semi-additive processes (SAP) that will help the industry achieve the seemingly impossible (less than 25 micron features that are coming our way)!

Features:

• SLP: The Next Level of Technology, by Patty Goldman
• Additive Electronics: PCB Scale to IC Scale, by Tara Dunn
• The Changing Shape of the HDI Market, by Roger Massey
• Catching up with… James Rathburn, President, HSIO Technologies, by Dan Beaulieu
• Smartphone Substrate-Like PCBs Will Revolutionize the IC substrate and PCB Markets, by Emilie Jolivet

Columns and Articles

• Understanding Resist Lock-in and Extraneous Copper, by Mike Carano
• Copper Pillar Plating Systems: High Speed, Low Heat, by E. Walch, DJ., C.Rietmann, Ph.D., and A. Angstenberger, Ph.D.
• Global Sourcing: The 5 Cs of Choosing the Right PCB Supplier, by Steve Williams
• Meet Nicolas Robin, IPC’s New Senior Director in Europe, by John Mitchell

Has the definition of reliability changed, and if so, why? What is driving this change? One reason is clear: Electronics are not an occasional luxury, they are an integral and nearly constant component in most people’s daily lives, from automotive electronics to alarm systems to cellphones. Reliability is critical, and the industry wants to deliver. This month, our experts provide their perspective on the evolution of reliability across sectors.

Features 

• Building a Better Board: It Always Comes Back to Communication by the I-Connect007 Editorial Team 
• The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors, by Happy Holden 
• PCBs are Moisture Sensitive Devices, by Richard Heimsch 
• Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits, by George Milad, Jon Bengston and Don Gudeczauskas 

Columns 

• Reliability Takes on New Meaning and Urgency, by Patty Goldman 
• Reliability Thoughts on the Department of Defense, by Dennis Fritz 
• A Tale of Zinc Tails, by Michael Carano 
• Factors of Reliability, by Sam Sangani 
• Mina: RFID, LED and What Else? by Tara Dunn

With all the elements that can now affect the solder mask—finer features, higher-temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention. This month, our contributors explain how and why solder mask must do its job well—precisely, in fact.

Features:

• Solder Mask: You’ve Come a Long Way, Baby, experts’ discussion with the I-Connect Editorial Team
• Countering Solder Mask Residue Concerns, by Rick Nichols, et al.
• Circuit Automation on the Ever-Evolving World of Solder Mask, experts’ discussion with the I-Connect007 Editorial Team
• Thermal Capabilities of Solder Masks: How High Can We Go?, by Sven Kramer

Columns:

• More Than a Word: Solder Mask, by Patty Goldman
• Flexible Metalization, Part 2, by Mike Carano
• Automotive Electronics: Past, Present, Future, by John Mitchell

Much like the ubiquitous rubber ducky, it seems that PCB manufacturing has not changed much through the decades, but what has changed is the required precision of those steps to achieve ever finer features at ever higher quality and reliability. This month, our experts offer up new wet processes, and tips and best practices for successful plating, and more.

Features

• Experts Discussion: MacDermid Enthone Talks Wet Processing in 2018, by the I-Connect007 Editorial Team
• Autocatalytic Gold: How it Fits as a Final Finish, by Rick Nichols
• Developments in Wet Processing: Beyond Spraying and Dipping, by Marc Ladle
• Advanced Copper Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper, by Saminda Dharmarathna, et al.
• Characteristics of New Electroless Au/Pd/Au Process for Fine Line Application, by Tetsuya Sasamura, et al.
• PTH Failure Mechanisms and Using IST as a Tool, Part 1, by Michael Carano

Columns

• Staying Current on Wet Processes, by Patty Goldman
• Lean Challenges: Standard vs. Non-Standard Products, by Didrick Beck, Elmatica

What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, are we there yet? Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era.

Features

• May the G Force Be with You—an Approaching Megatrend, by Dan Feinberg
• PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G, by Stig Kallman
• Experts Discussion: What Does 5G Mean to Materials and EDA Tools? by I-Connect007 Editorial Team
• Excerpts from Prismark's Presentation at CPCA 2018, by Prismark Partners LLC
• 5G--Generation after Generation, by Patty Goldman

Columns and Articles

• What’s in Your ET? by Todd Kolmodin
• The Velocity of Technology—What Does It Really Mean? by Jan Pedersen
• Surface Preparation and Cleaning, Part 1, by Michael Carano
• The Value of Coopetition, by Steve Williams
• IMPACT 2018: We Need Your Voice in Washington, D.C.! by John Mitchell
• CPCA Seminar Overview, (Presented in Shanghai, March 2018) by Happy Holden

From autonomous vehicles to e-textiles to automotive standards, our contributors take a look under the hood and kick the tires this month to bring the rapidly evolving world of automotive electronics into perspective. 

Features

• Autonomous Transportation: Using Disruptive Technologies to Create Social Disruption and Change, by Dan Feinberg
• Future Automotive Requirements for PCBs, Dr. Christian Klein
• International Automotive Task Force (IATF) 16949 Standard, Explained, by Steve Williams
• E-Textiles—the Wild Frontier, by Tara Dunn
• Automotive, the Electronics Industry's New Driver, by Patty Goldman

Columns and Articles

• How are the Ratings? by Todd Kolmodin
• Looking at PTH Voids, by Michael Carano
• Process Control for HDI Fabrication, by Happy Holden
• Meet IPC’s Vice President of Global Government Relations, Chris Mitchell, by John Mitchell

No doubt, new technology seems to be launching daily, from inspection systems to photoresist processes. How can we keep up? How can we even maintain? What’s coming next and how can we best prepare, to stay in the game? This month, our experts give us a heads up on new technology: where we’re at and where on Earth we are going.

Features

• The Disruptive Rate of Disruptive Technologies, by Dan Feinberg
• GreenSource: Good for the Industry, Good for the World, by the I-Connect007 Editorial Team
• Elga Europe Reality and Ultra-High-Resolution Photoresist, by Patty Goldman
• Schmid Looking to the Future for Industry 4.0 and More, by Patty Goldman
• AVI—Your Tireless Friend in Final Inspection, by Todd Kolmodin
• What’s New? by Marc Ladle
• Something New for Everyone, by Tara Dunn

Columns

• The Direction of New Technology, by Patty Goldman
• Pits and Mouse Bites, Part 3, by Michael Carano
• The Rebirth of Made in America, by Steve Williams

Who is your customer? Isn’t it more than that person who buys something from you or your company? After all, aren’t the tables turned when you request something from that “customer?” Aren’t you then the customer? Find out what our experts think this month. The answers may surprise you! 

Features 

• Defining Customer-Supplier Relationships and Customer Satisfaction, interview with Steve Williams
• Communications: Bridging the Customer-Supplier Gap, interview with Nolan Johnson & Dan Beaulieu
• Invited Guests to the Party, by Tara Dunn 
• Understanding Your Customers, by Steve Williams 
• One Great Customer Service Story, by Dan Beaulieu 
• Who is Your Customer? by Dan Feinberg 
• Who is the Customer? by Dan Beaulieu 
• Defining Your Customers, by Sam Sagani 
• Catching up with Dan Thau of Millennium Circuits Ltd., by Dan Beaulieu 

Columns 

• IPC 6012-DA Revisions: The Approach to Cleanliness, Thickness, Inspection, and Wicking, by Jan Pedersen 
• Surface Preparation and Cleaning, Part 1, by Mike Carano 
• Questions That Sell: The Powerful Process for Discovering What Your Customer Really Wants, a book review by Dan Beaulieu 
• Skilled Talent: Can We Meet Rising Demand?, by John Mitchell

As equipment gets more sophisticated and costly, determining equipment needs has become far more complicated. Choosing wisely—and correctly anticipating your and the market’s needs—has never been more critical. Our experts are well equipped to give us their professional perspectives on just what to consider when evaluating new equipment. 

Features 

• Making the Right Equipment Selection, by Patty Goldman and Stephen Las Marias 
• Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design, by Alex Stepinski 
• Whelen Engineering and AWP Explain their Unique Collaboration, by Patty Goldman 
• The Selection of Chemical Etching Equipment for PCB Production, by James Hall

SPECIAL SECTION: IPC APEX EXPO 2018 Pre-Show Coverage

• A Sneak-Peek at IPC APEX EXPO 2018 with John Mitchell
• Keeping it New, Current and Relevant: IPC Conference Director Jasbir Bath
• CFX: Updates and Developments with Nancy Jaster
• All the Details on IPC’s Emerging Engineer Program with Teresa Rowe & Nancy Jaster
• What to Expect at IPC APEX EXPO 2018: EXPO Veteran Alicia Balonek Shares
• IPC APEX EXPO App is Where It’s At with Kim DiCianni

Columns 

• New Year, New Equipment--Right?, by Patty Goldman
• All the Fun of the Fair: Behind the Scenes at productronica 2017, by Mark Ladle 
• Case Study: Pits and Mouse Bites, Part 2, by Michael Carano 
• Willy Wonka: The Lean Case Study, by Steve Williams 
• Electronics Industry Advocacy is More Important in 2018 than Ever, by John Mitchell 

Check out our Career Opportunities section.

Increasing consumer demands for high-performance and the need for high-reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing. This month, industry experts are in the hot seat to explain how to keep everything cool.   

Feature Content

• Understanding Thermal Management and Materials to Boost Power Electronics Reliability, by Mark Goodwin
• Thermal Management: A PCB Manufacturer’s Perspective on Insulated Metal PCBs (IMPCBs), by Anaya Vardya and Dave Lackey
• Thermal Management Considerations at the Bare Board Level, by Jim Barry
• Evolution of Thermal Management in PCBs, by Gareth Parry, P.Eng   

Columns

• Getting the Heat Out, by Patty Goldman
• The Power of Flex, by Tara Dunn
• The Copper Foil Shortage: Why, How and What to Expect, by Didrik Bech
• Case Study: Solving Plating Pits and Mouse Bite Issues, Part 1, by Michael Carano
• Culture Shift is Key to Quality Improvement, by Steve Williams

This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manufacturing challenges, to HDI strategies that include design, fabrication, and assembly perspectives. As one of our feature contributors, Happy Holden, says, in North America, there is a growing need for more HDI capability. Find out why in this issue!

TOC:

Feature Content

• 35 Years of HDI Fabrication Process and Obstacles for Implementation, by Happy Holden
• Moving into Microvias, Part 2, by Mike Carano
• Strategies for High-Density PCBs, by Vern Solberg
• HDI: Today, Tomorrow and the Future, by the I-Connect007 Team

Columns

• HDI: Born in the USA and Making a Comeback, by Patty Goldman
• Industry 4.0, AI and CircuitData, by Andreas Lydersen
• FlexFactor: Faith in the Future, by Tara Dunn
• Connecting the Dots Between Manufacturing and Community, by John Mitchell

If you think signal integrity is just a design problem, think again. As board features get smaller, as speeds get faster, and as more is expected from everyone in the supply chain, signal integrity should have everyone’s attention. This month, our experts explain why.

Feature Content

• (Signal) Integrity for All, by Patty Goldman
• Planning a PCB: Signal Integrity and Controlled Impedance Considerations, by John (Josse) Steinar Johnsen
• Fabricating for Signal Integrity, by Marc Ladle
• Experts Discussion: Signal Integrity and Impedance Control, by Patty Goldman and the I-Connect007 Editorial Team
• PCB Signal Integrity Optimization Using X-ray Metrology, by Scott Jewler
• HDI’s Beneficial Influence on High-Frequency Signal Integrity, by Happy Holden

Columns

• The Critical Importance of Rinsing, Part 2, by Michael Carano
• Become an Expert!, by Keith M Sellers
• Steve’s Particular Set of Skills (to become a World-Class Quality Manager), by Steve Williams
• Pursuing New Solutions to the Electronics Sectors’ Skills Gap, by John Mitchell

This month, we’re revisiting process engineering from the perspective of industry veterans with direct experience and who know what they’re talking about. Read what it’s all about, discover new techniques, gain fresh insights, and learn true appreciation for process engineeers, the backbone of PCB manufacturing.

Table of Contents
Features

• The Fundamentals of Process Engineering, by Patty Goldman
• The Value of Process Engineering in PCB Manufacturing, by George Milad
• PCB Process Engineering: Details from One of the Originals, by Happy Holden
• Navigating Process Change? TPC is the Key, by Steve Williams
• Process Engineering and Defect Prevention, by Michael Carano
• Back to Basics, by Marc Ladle
• The Man Behind the Curtain, by Tara Dunn

Articles and Columns

• The Future of Electronics in the Automotive Industry, by John Mitchell
• 3D Printed Electronics for Printed Circuit Structures, Samuel LeBlanc, et. al.
• Myths about Millennials: Workplace Safety Matters, by Barry Lee Cohen

Exactly what defines process step elimination and/or automation? So many possibilities! Does it include reducing the number of steps in manufacturing a PCB? Eliminating queue times, inspection or cleaning steps? Is automation adding a hoist to your plating line, or conveyorizing everything? These considerations and more by industry experts will give you plenty to think about as the summer sun sets on the horizon.

Table of Contents

Features

• Whelen Engineering, Two Years Later, by Patty Goldman and Happy Holden 
• Cycle Time Reduction Through W.O.R.C., by Steve Williams 
• Why is the Developer Missing at BATM Systems’ Romania Facility?, by Marc Ladle 
• Laser Patterning and Metallization to Reduce Process Steps for PCB Manufacturing, by J. Schrauben, C. Tribe, C.Ryder & J. Kleinert 
• No Missed Steps: 5S Methodology for a Smarter Workplace, by Todd Kolmodin 

Columns 

• Knowledge is Power, by Tara Dunn 
• Moving into Microvias: The Interaction of Materials and Processes, Part 1, by Michael Carano 
• Professor Plum in the Library with the Candlestick…Right? by Keith M. Sellers 
• India Makes Manufacturing Gains to Participate in a Global Economy, by John Mitchell 

Article 

• High-Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes, by Saminda Dharmarathna, Ivan Li, Maddux Sy, Eileen Zeng, Bob Wei, William Bowerman, and Kesheng Feng

The present and future challenges of mil/aero electronics are covered from A to Zentech this month, including a special interview section on IMPACT, Washington D.C. 2017. From the DoD budget to the new cyber-security regulations, and of course, reliability issues, it’s all included.

Features

• Defense Budget Analysis: Patience is a Virtue, by John Vaughan, with Brian Friel
• Strategies for Compliance with DoD Regulations Including ITAR and DFARS, by Didrik Bech
• Time to Show our Hand? by Marc Ladle
• Mil/Aero Electronics Supply Chain Facing New Challenges, by Stephen Las Marias
  
• IPC's IMPACT 2017: Special Section, by Patty Goldman
• Review of the 2017 IPC Reliability Forum, by Steve Williams

Columns

• Three Ways to Close the Skills Gap in U.S. Manufacturing, by John Mitchell
• The Critical Importance of Rinsing, Part 1, Michael Carano

Article

• Automotive Suppliers Must Manage Data for IMDS Compliance, by Derrik Snider

Embedded technology seems finally to be coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found in that most ubiquitous of consumer products, the smartphone, as you will learn in this issue. They are truly all around us!

Features

• Patty's Perspective: Embedded Technology: It's All Around Us, by Patty Goldman
  
• Embedding Components, Part 1, by Vern Solberg
• A Brief Tutorial on Embedded Capacitors, by Jesse Ward
• Thin Film NiP Embedded Resistors in Heater Applications, by Manuel Herrera
• Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization, by Thomas Hofmann
• A Deep Look into Embedded Technology, by Barry Matties and Patty Goldman

Article and Columns

• Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects, by Thomas Jones, Dr. David Flynn, Marc P.Y. Desmulliez, and Dennis Price
• The Right Approach: Is Exceptional Service Worth a 40% Cost Increase?, by Steve Williams
• One World, One Industry: Having an Impact from the Shop Floor to the Halls of Government, by John Mitchell

Extras: NEW! Career Opportunities Section, Events Calendar, News Highlights and more!

Everyone is talking about the graying of our industry and the lack of qualified applicants for jobs, ranging from manufacturing personnel to engineers and even management. Who will take over when we retire? Do we simply find qualified individuals or create them? How do we attract and retain them? Find out this month in The PCB Magazine!

Features

• Finding the Next Generation of Board Rats, by Steve Williams
• “Help Wanted” with IMI Circuits’ Peter Bigelow, by Patty Goldman
• Dave Ryder on Prototron Circuits’ Strategy for Hiring in Today’s Marketplace, by Patty Goldman
• Recruiting and Retaining Young Talent, by Sam Sangani
• Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and their Road Show, by Patty Goldman
• David Dibble on the Hiring Process, Interview with Dan Beaulieu
• Employee Recognition: More than Money, by Barry Lee Cohen
• How to Find—and Retain—the Right People for the Right Jobs, by Patty Goldman
• Random Thoughts on Employment, from Both Sides of the Table… by Keith M Sellers
• A Conversation with an Industry Twenty-Something, by Patty Goldman
• Industrial Knowledge—Preparing the Next Generation, by Patty Goldman

Columns

• Patty's Perspective: Help Wanted—And How!, by Patty Goldman
  
• Trouble in Your Tank: The Desmear Defect Guide, by Michael Carano
• Testing Todd: Flying Probe Testing vs. IPC-9252B, by Todd Kolmodin
• One World, One Industry: China—A Critical Partner for Trade, by John Mitchell

Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed.

Features

Material Choices for High-Speed Flexible Circuits, by G. Sidney Cox

Interview: Fabricators Speak Out on High-Speed Materials, by I-Connect007 Research Team

PCB Technology Requirements for Millimeter-Wave Interconnect and Antenna, by Jim Francey and Terry Bateman

Interview: TTM Shines a Light on Optical Interconnect, by I-Connect007 Staff

Columns

Faster, Faster, Faster… or the Need for Speed, More Speed!, by Patty Goldman

Testing Todd: Go with the Flow, by Todd Kolmodin

Let’s Talk Testing: You’re in for a (Thermal) Shock! by Keith M. Sellers

Trouble in Your Tank: Copper-to-Copper Peeling, by Michael Carano

One World, One Industry: 100 Days In: President Trump and a Better Manufacturing Policy, by John Mitchell

Launch Letters: Nasty News Releases, by Barry Lee Cohen

Bonus Article

Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation, by Steve Vetter, et al.

This month, we’re talking flexible circuits, including  all the variations of same, which is why we’re calling this issue “The Wide World of Flex.” The world of flex  is broad—and it’s rapidly getting wider!

Feature Interview: American Standard Circuits Releasing e-Book on Designing Flex and Rigid-Flex

Feature Articles

• The Wide World of Flex, by Dave Becker
• Flex Material Handling: An Inside Peek, by Tara Dunn
• Crucial Considerations for Building Flexible Heaters, by John Talbot
• Stepping Up to Laser Processing for Flex, Part Five: Process Development, by Patrick Riechel
• Understanding Dimensional Stability in Flexible Circuits, by Dave Becker
• Stretching Beyond Flex, by Andy Behr

Columns and Articles

• Stay Flexible by Patty Goldman
• IPC’s Global Policy Framework for 2017—Smart Advocacy for the Industry, by John Mitchell
• MACFEST: Benchmarking a New Solderable PCB Finish, by Thomas Jones
• Improving Solderability and Corrosion Resistance for Final Finishes, Part 1, by Michael Carano

As technology moves increasingly faster, so do our equipment, materials and chemistry suppliers to help us to enable that next greatest invention. Are you ready for the next thing, to keep pushing forward? This month, our contributors shed a little light on that path forward. Meet the future!

FEATURES

• Emerging Technology, Training for the Future, and the Next Industrial Revolution, by John Mitchell
• Vertical Conductive Structures—a New Dimension in High-Density Printed Circuit Interconnection, interview with Joan Tourne
• Industry 4.0—Inkjet Technology is Changing the World of PCB Manufacturing, by W. Brok, et al, Meyer Burger
• The Power of Three: A Solder Mask Solution for North America, by Dick Crowe, Burkle NA
• Taiyo’s John Fix on New Materials, Products in the Works, an interview with John Fix
• Schmoll Talks Technology, an interview with Thomas Kunz
• Inkjet Printing Solder Mask, an interview with Frank Louwet and Mariana Van Dam
• EIPC Workshop on PCB BioMEMS, by Alun Morgan

COLUMNS

• New Technology Heading our Way—Faster than Ever!, by Patty Golman
• Why Trump Will Be Good for Our Industry, by Steve Wiliams, TRAC
• Metalizing Difficult-to-Plate Substrates, by Michael Carano
• How Strong is Your Foundation? by Keith M. Sellers
• E-Newsletter Magic, by Barry Cohen

Even more!

So what is new in plating and surface finishes? This month, our experts weigh in on new processes, the tried-and-true old processes, R&D, and how to go about choosing the right process from among all those available today.

Features

• Study of Immersion Gold Processes for both ENIG and ENEPIG, by Don Gudeczauskas, Albin Gruenwald and George Milad
• Acid Copper Plating—Understanding What’s Often Taken for Granted, by Michael Carano
• Electroplated Copper Filling of Through-holes’ Influence on Hold Geometry, from the team at MacDermid Enthone

Feature Columns

• Everything Old is New Again, by Patty Goldman
• Final Surface Finish: How Do You Choose?, by Tara Dunn
• Plating and Surface Finish: The Challenges to Electrical Test, by Todd Kolmodin
• ENIPIG—Next Generation of PCB Surface Finish and MACFEST Dissemination Webinar, by Pete Starkey

More Columns

• Implications of the Trump Presidency, by John Mitchell
• Now is the Time for Comprehensive Tax Reform, by John Hasselmann
• Fake News: It Could Happen to You, by Barry Lee Cohen

Our feature contributors have plenty to say this month, including thought-provoking ideas and unique perspectives they’ve accumulated in the quest for successful sales and marketing strategies. We open this issue with results of our monthly survey on the topic at hand, and a breakdown of the responses.

Features

• We're All in Sales, by Patty Goldman
• Much Ado about Sales and Marketing, by the I-Connect007 Research Team
• Customer Acquisition, by Dave Becker
• Five New Books that Will Change Your Perspective on Sales and Marketing, by Dan Beaulieu
• Selling Technology—a PCB Engineer Transitions to Sales, by John Tusant
• 4 Reasons Why Every Sales’ Rep’s Toolkit Should Include LinkedIn, by Bruce Johnston
• Strengthening Your Value Proposition to Boost Organization Success, by John Mitchell
• A Glimpse into PCB Sales, by Tara Dunn
• Catching Up with M&A Expert Tom Kastner, by Dan Beaulieu
• Catching up with LinkedIn Expert Bruce Johnston, by Dan Beaulieu

Columns

• Programs, Not Projects, by Barry Lee Cohen
• Mechanical Drilling, Part 2, by Michael Carano
• Are You Getting What You’ve Asked for? by Keith M. Sellers
• Understanding Predictive Engineering, by Happy Holden

Blind, buried, landless…IPC defines no less than seven type of vias. This month, our experts shed light on the many different types of vias, their functions, and the various challenges associated with them.

Table of Contents

Features

• Vias for Dummies, by Keith M. Sellers, NTS-Baltimore
• Innovative Use of Vias for Density Improvements, by Happy Holden
• Via Formation and Drilling Mechanics, Part 1, by Michael Carano, RBP Chemical Technology
• Advanced UV Lasers for Fast, High-Precision PCB Manufacturing, by Jim Bovatsek, Spectra-Physics
• Unique Implementation of a Rigid-Flex Circuit, by J. Dangler, IBM; J. Taylor, Lenovo; and C. Verbrugge, Amphenol
• Stepping Up to Laser Processing for Flex, Part 4: Installation, Training and Initial Operation, by Mike Jennings and Patrick Riechel, ESI

Interviews and Columns

• HKPCA’s Daniel Chan on China’s PCB Manufacturing and Technology Landscape, by Edy Yu, I-Connect007
• HKPCA & IPC Brings Hand-Soldering Competition World Championships to China, by Edy Yu, I-Connect007
• 225 Tech Talks—1995 to 2016, by Karl H. Dietz, Karl Dietz Consulting
• My Graphic Grief: Trade Shows and Events, by Barry Lee Cohen, Launch Communications

Everyone has the chance to benefit from the wealth of experiences our contributors—leaders in the industry—are sharing this month, from real-world examples of leadership, to principles that have stood the test of time.

Features

• Leadership and …You, by I-Connect007 Research Team
• Lessons in Leadership from My Father, by Yash Sutariya, Saturn
• Biz Brain IQ Test, The Surprising Results, by David Dibble
• Six Leadership Lessons from 20 Years in the Electronics Industry, by John Mitchell, IPC
• Leadership Lessons from the Rio Olympics 2016, by Renato Peres, Circuibras
• My Leadership Journey, by Steve Williams, The Right Approach Consulting
• Are You a Leader or a Manager? by Todd Kolmodin, Gardien Services USA
• Three Keys to Successful Leadership, by Sam Sangani, PNC Inc.
• 10-Step Business Plan Process, by Happy Holden

Columns

• Take Me to Your Leader, by Patty Goldman
• Trouble in Your Tank: Case Study: Plating Nodules, Where Did These Come From? by Michael Carano
• Let’s Talk Testing: Don’t Reinvent the Wheel, Find an Expert! by Keith M. Sellers
• Launch Letters: Trade Shows: The Unstoppable Force, by Barry Lee Cohen

Features

• F-35 Declared Combat Ready, by John Vaughan, Zentech Manufacturing
• Disruptive Technologies—VR, AR and Star Trek, by Dan Feinberg, Feinlein Associates Inc.
• Flex Circuit Specifications for Commercial and Military Application, by Dave Becker, All Flex Flexible Circuits LLC
• Troubleshooting Flex Circuit Applications for Mil/Aero Projects, by Tara Dunn, Omni PCB
• Does your Product have a Military Application? by Keith M. Sellers, NTS
• Testing Military/Aerospace—Houston, We Have a Solution, by Todd Kolmodin, Gardien Services USA
• FOD and the Aerospace Industry, by Steve Williams, The Right Approach Consulting

Columns & Articles

• Patty’s Perspective: Are We Flying Yet? by Patty Goldman
• Karl’s Tech Talk: Epoxy: Supply Chain and Use in Electronics, by Karl Dietz
• Launch Letters: Take Social Media Seriously, by Barry Lee Cohen
• Happy’s Essential Skills: Lean Manufacturing, by Happy Holden

Features

• Alex Stepinski, Our First Recipient of the Good for the Industry Award, by Barry Matties
• Our Readers Speak Out: Voices of the Industry, a compilation
• The Authors of the Printed Circuits Handbook Speak
• Spirit Circuits: Building a New Factory in Romania—an interview with Steve Driver
• Eltek Looking for Strong Growth in the US—an interview with Jim Barry
• The European Space Agency on Reliability—an interview with Stan Heltzel
• The Many Voices Over the Past Year: The PCB007 Interview Index

Article

• Factors Affecting the Adhesion of Thin Film Copper on Polyimide, by David Ciufo, et al.

Columns

• Patty’s Perspective: Speak Out! by Patty Goldman
• Trouble in Your Tank: Building Reliability into the PCB, Part 2, by Mike Carano
• Let’s Talk Testing: Welcome Your Product to the Real World, by Keith M. Sellers
• Launch Letters: Embrace Your Brand, by Barry Lee Cohen

There’s more to test and inspection than the latest and greatest AOI and electrical test equipment. This month, feature contributors from Orbotech, Gardien Services, Uyemura, and more, examine various testing methods that go into ensuring great product.

Features

• Faster, More Accurate AOI is More Important than Ever, by Micha Perlman, Orbotech
• Seeing is Believing in Fractographic Analysis, by Keith M Sellers, NTS
• Round Robin of High-Frequency Test Methods by IPC-D24C Task Group (Part 1), by Glenn Oliver, Jonathan Weldon, et al., DuPont*
• Test & Measurement: The Case for Validation, by Todd Kolmodin, Gardien Services USA
• A Thermal Conductivity Measurement Method, Adapted to Composite Materials Used in the PCB Industry, by F. Lechleiter and Y. Jannot
• The Evolution and Revolution of Impedance Control for PCB Production, by Renato Peres, Circuibras
• Using the Type 1 Gauge Study to Assess Measurement Capability,by Patrick Valentine, Uyemura USA

Columns

• Patty’s Perspective: Delving into Test and Inspection, by Patty Goldman
• Trouble in Your Tank: Building Reliability into the PCB, Part 1, by Michael Carano
• Karl’s Tech Talk: Digital Imaging Update, by Karl Dietz
• Launch Letters: Give Your Literature Some Lovin', by Barry Lee Cohen

Fine features are the topic this month, and our industry experts are on hand to discuss issues ranging from landless vias to laser direct imaging and high throw electroless copper for very small holes and blind vias.

Features

Against the Density Wall: Landless Vias Might be the Answer, by Happy Holden

Flexible Circuit Fabrication and Cleanroom Manufacturing, by Dave Becker, All Flex Flexible Circuits

High-Throw Electroless Copper—New Opportunities for IC Substrates and HDI Manufacturing, from Atotech

Special Section and Articles

IMPACT Washington, D.C. 2016: Interviews and Editor’s Re-cap, by Patty Goldman, I-Connect007

The 21^st Century PCB Factory—Designed to Eliminate Offshore Cost Advantages, by Alex Stepinski, Whelen Engineering

Columns

Patty’s Perspective: Impacting the Industry—Literally, by Patty Goldman

Trouble in Your Tank: Primary Imaging for Pattern Plating, Part 2: Development, by Michael Carano

The Right Approach: Our IoT Lives, by Steve Williams

Launch Letters: Exceptional Service—Extra Toppings without Sacrifice, by Barry Lee Cohen

Handling and people-related mistakes and defects are always a concern in manufacturing. What’s the answer? Is it automation? Is it more training? A little of both? This month, our experts weigh in on the who, what, when, where and how of reducing handling errors.

Features

• Automate to Innovate in Flex Processing, by Mark Wegner, Northfield Automation Systems and Patrick Riechel, ESI
• Quick & Easy 6S to Reduce Handling Issues, by Steve Williams, The Right Approach Consulting LLC
• Case Study: Reducing Defects Caused by Excess Handling and Mishandling, by Yash Sutariya, Saturn Electronics/Saturn Flex Systems
• Material Handling Innovations: Should You Automate? by Happy Holden
• Flexible Circuit Fabrication and Cleanroom Manufacturing, by Dave Becker, All Flex Flexible Circuits LLC
• Automation is the Talk of the Town at CPCA Show 2016, by Pete Starkey, I-Connect007

Columns

• Patty’s Perspective: Getting a Handle on Handling Errors, by Patty Goldman, I-Connect007
• Trouble in Your Tank: Primary Imaging for Pattern Plating, Part 1, by Michael Carano
• Testing Todd: Quality Management and the Hidden “I” in Team, by Todd Kolmodin
• Karl’s Tech Talk: Electronic Packaging Levels, by Karl H. Dietz

Process engineers (and PE types) are the worker bees of the industry. In addition to writing standards and specifications or presenting the technical papers at industry events, they stay busy behind the scenes—running tests, gathering data, coming up with new ideas, developing new products, and so forth. Our experts this month bring first-hand knowledge of the phenomenon known as process engineering.

Features

• Process Engineering: PCB Manufacturing’s 'Delta Force,' by Joe Fjelstad, Verdant Electronics
• A Process Engineer’s Guide to Effectively Troubleshooting PWB Defects, by Michael Carano, RBP Chemical Technology
• Process Management: Doing It Right, by Todd Kolmodin, Gardien Services USA
• Focusing on What Matters Most! by Renato Peres, Circuibras
• Flexible Circuits and Kaizen Events, by Dave Becker, All Flex Flexible Circuits

Columns and Articles

• A Salute to Process Engineers, by Patty Goldman
• Best Practices: It’s Only Common Sense, by Steve Williams
• Long-Term Thermal Reliability of PCB Materials, Eva McDermott, Ph.D., et al., Amphenol Printed Circuit Board Technology

This month, The PCB Magazine looks to the horizon at new and emerging interconnects, with features by BPA and Ormet, along with a comprehensive collaboration between nScrypt and the University of Texas, El Paso. 

Navigating the industry’s standards and regulations can be a lot like sur?ng a killer wave: One misstep and you could wipe out! As EIPC Technical Director Michael Weinhold discusses with I-Connect007’s Pete Starkey, are standards and regulations a threat, or an advantage? Also on hand: Dan Gamota, who addresses standards for the monetization of PE, Dennis Fritz on the newly developing efforts of CAMEST, and IPC’s Dave Torp.

This month, The PCB Magazine presents the many sides of ?ex and rigid-?ex circuits, which have  myriad applications in just about every sector of the electronics industry. Their ability to be formed into complex three-dimensional  geometries, or to withstand multiple cycles during their functional life, adds a third dimension to the concept of the interconnecting substrate.

This month, features from Saturn, BPA Consultants, Zuken and Delphi take on some big questions, beginning with whether or not a PCB manufacturer should even pursue the automotive electronics market, to the power of MiB, and other design challenges.  

This month, STRATeVU’s Steve DeWaters demysti?es the often complex world of military electron-ics and DoD spending, while Graphic Plc’s Ashley  Luxton demonstrates the utility of applications  engineering to PCB design and manufacturing. Finally, Circuit Solutions’ John Vaughan explores the intersection of unmanned vehicle systems and electronics technology. 

In this highly competitive industry of ours, where material costs squeeze from one side, and customers squeeze from the other, what is the answer to increasing profits? This month, our contributors offer strategies that we think will both surprise and enlighten!

Features

• Increase Profits by Minimizing Inspection, by Steve Williams, The Right Approach Consulting LLC
• The Four New Agreements to Explode Profitability, by Dave Dibble
• PCB Sourcing? One Size Does Not Fit All, by Tara Dunn, Omni PCB
• Lean Manufacturing and NPIP for Flexible Circuits, by Dave Becker, All Flex Flexible Circuits LLC
• Cost Saving Tips for PCB Fabrication, by Akber Roy, RUSH PCB Inc.
• Stepping up to Laser Processing for Flex, Part 2: Calculating and Optimizing Production, by Mike Jennings and Patrick Riechel, ESI 

Articles and Columns

• Direct Metallization System for Flexible Printed Circuits, by R. Mohanty, A. Angstenberger, M. Rischka and H. Verbunt, MacDermid  Enthone Electronics Solutions
• Green Legislation and the Impact on Electronic Materials and Processes, by Karl H. Dietz
• PCB shops in Brazil: Are you kidding me? by Renato Peres, Circuibras

We’ve covered it from top to bottom this month—what’s brand new in the world of PCB fabrication and what’s on the horizon for our industry. Feature articles, interviews and columns reach into material and process solutions, 3D printing, surface finishing, and more!

Features

• New Material and Process Solutions for the Electronic Interconnection Industry, by Joseph Fjelstad, Verdant Electronics
• Interview: Printing PCBs...in Your Office! by Barry Matties, I-Connect007
• Copper Via-Fill Technology in Development, by Tara Dunn, Omni PCB
• Cyanide-Free Im
• Interview: Camtek Takes Inkjet Technology into the Future, by Barry Matties, I-Connect007
• Cyanide-Free Imersion Gold Suitable for PCB Surface Finishing, by Jun Nable, Ph.D., et. al., MacDermid Inc.
• The Next Step: Technology That’s Driving Smaller Microvias, by Osamu Sekine, Nano System Inc.
• Solder Mask for LED Applications: Formulation 101, by Josh Goldberg, Taiyo America