A Summary of Various Test Requirements


Reading time ( words)

IPC Class 3

The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing of technologies, which has caused the requirements of electrical test of these higher technology products to advance and increase in intensity. Obviously, the more mature a technology, the finer the lines and spaces must be, the more hole and vias must be present, and the more complex the testing must become. There is just more to test in a smaller amount of space.

Long gone are the “pin-in-hole” technology PCBs, which are now surpassed by the large multilayer, blind/buried and rigid-flex technologies. For the suppliers of electrical test, be it in-house test departments or sub-contracted, the industry specifications can be confusing, and at times incomprehensible.

The OEMs direct the IPC specification (6012, 9252A, AS9100, etc.) for their fabrication to the manufacturer, but in many cases do the OEMs or CMs really know what they are asking for? Do they really understand what they are requiring and how complicated it may be?

There are many variables associated with these specifications and requirements to their designated classes regarding electrical test. OEMs  often overlook the electrical properties associated with IPC class performance requirement, and  of course, this can be a problem. Manufacturing, plating, etching and all those processes may be within the class requirements.

During the coming months, I will discuss various aspects and intricacies of electrical test. To get started, I will address IPC class 1, 2, and 3

Class I: General Electronic Products

This class includes consumer products, some computer products and computer peripherals suitable for applications where cosmetic imperfections are not important, and the major requirement is function of the completed board.

Read the full column here.


Editor's Note: This column originally appeared in the April 2014 issue of The PCB Magazine.

Share




Suggested Items

Carol Handwerker Appointed to NIST Advisory Committee

06/06/2023 | Michelle Te, I-Connect007
We often hear words and phrases that naturally go together: Salt and pepper, touch and go, trace and space. When it comes to the work of IPC member Carol Handwerker, however, the collocations are much more nuanced, deeper, and have greater significance. You’re more likely to think of phrases such as standards and technology, lead-free and solder, or advanced packaging and heterogeneous integration. These are just some examples of Carol’s lifelong work in materials engineering, involvement with governing bodies, and a forward-thinking approach to electronics manufacturing that has spanned more than three decades.

A Focus on Ultra HDI

06/05/2023 | Nolan Johnson, I-Connect007
John Johnson is relatively new to American Standard Circuits, but definitely not new to the technology. In fact, he was hired to focus on business development for ultra-high-density interconnects. John explains more about the process and where it’s taking ASC.

PCBAA Reacts to Implications of Biden’s PCB Determination

04/05/2023 | Nolan Johnson, I-Connect007
Hot on the heels of the news that U.S. President Biden signed a presidential determination in support of the printed circuit board industry, I-Connect007’s Nolan Johnson spoke with David Schild, executive director of the Printed Circuit Board Association of America, about some of the expected implications. David points out, among other things, that this signals increased momentum with government and defense to support U.S.-based printed circuit manufacturing, and the possibility that a renewed interest in the industry by private financing could possibly follow.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.