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Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
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RTW IPC APEX EXPO 2019: The Circle Is Complete
February 12, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.
To watch the interview, click here.
Suggested Items
Three Industry Leaders Receive IPC President’s Award
04/17/2024 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024.
IDTechEx Discusses the Role of Printed Sensors in Mass-Digitization
04/11/2024 | PRNewswireIntegrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
NetVia Group Acquires Direct Imaging from Mivatek
04/09/2024 | Miva TechnologiesMiva Technologies is pleased to announce NetVia Group, Irving, TX has acquired a new Miva 2400NG Dual Tray Direct Imaging System with 30-micron capabilities for inner, outer and soldermask imaging.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
NextFlex Announces Lorain County Community College as First Education & Workforce Development Innovation Center
04/01/2024 | NextFlexNextFlex, America's Hybrid Electronics Manufacturing Institute, announced its first Education & Workforce Development Innovation Center to recognize Lorain County Community College (LCCC) located in Elyria, Ohio.