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Trouble in Your Tank: Via Hole Filling and Plugging, Part 2
In my previous column, I presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” I will discuss filling blind vias and through-holes with polymeric pastes.
Via Fill Paste
Often, the phrase “plugging paste” is used to describe the method and material of completely filling blind vias and through-holes. In general, paste filling material selection is at the request of the end user and indicated for a number of reasons. It has been my experience that major OEMs are driving the industry to migrate to the high-Tg/low-CTE plugging paste formulations for high-density applications. In addition, these formulations are of a non-conductive nature that provides a high-quality plugged via that is cost-effective. Limitations abound depending on PCB thickness, via diameter, and paste properties.
To read this entire column, which appeared in the October issue of PCB007 Magazine, click here.
More Columns from Trouble in Your Tank
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5Trouble in Your Tank: Electrodeposition of Copper, Part 6
Trouble in Your Tank: Electrolytic Copper Plating, Part 5
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 3
Trouble in Your Tank: Electrodeposition of Copper, Part 4—Addition Agents
Trouble in Your Tank: Lead-free and the Fabrication Challenge, Part 1
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 2